{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,23]],"date-time":"2026-01-23T09:34:34Z","timestamp":1769160874675,"version":"3.49.0"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung Electronics Co. Ltd.","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,2,16]]},"DOI":"10.1109\/isscc49661.2025.10904698","type":"proceedings-article","created":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T18:33:12Z","timestamp":1741285992000},"page":"1-3","source":"Crossref","is-referenced-by-count":1,"title":["22.4 A 32-to-50Gb\/s\/pin Single-Ended PAM-4 Transmitter with a ZQ-Based FFE and PAM-4 LSB DBI-DC Encoding"],"prefix":"10.1109","author":[{"given":"Yunseong","family":"Jo","sequence":"first","affiliation":[{"name":"Hanyang University,Seoul,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyuntae","family":"Kim","sequence":"additional","affiliation":[{"name":"Hanyang University,Seoul,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Young","family":"Choi","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaewoo","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Myoungbo","family":"Kwak","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaeduk","family":"Han","sequence":"additional","affiliation":[{"name":"Hanyang University,Seoul,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365925"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3104093"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454354"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454560"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2024.3403149"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3222203"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731614"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3114205"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2024.3408648"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454381"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731537"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662509"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870425"},{"key":"ref14","first-page":"248","article-title":"A 25.2Gb\/s\/pin NRZ\/PAM3 Dual-Mode Transmitter with Embedded Partial DBI Achieving a 133% I\/O Bandwidth\/Pin Efficiency and 19.3% DBI Efficiency","volume-title":"ISSCC","author":"Han","year":"2024"},{"key":"ref15","first-page":"693","article-title":"Energy-Efficient Bus Encoding Techniques for Next-Generation PAM4 DRAM Interfaces","volume-title":"IEEE Int. Conf. of Comp. Des.","author":"Su"}],"event":{"name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,2,16]]},"end":{"date-parts":[[2025,2,20]]}},"container-title":["2025 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904417\/10904496\/10904698.pdf?arnumber=10904698","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T06:32:02Z","timestamp":1741329122000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10904698\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2,16]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/isscc49661.2025.10904698","relation":{},"subject":[],"published":{"date-parts":[[2025,2,16]]}}}