{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,3]],"date-time":"2026-03-03T16:15:07Z","timestamp":1772554507197,"version":"3.50.1"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung Electronics","doi-asserted-by":"publisher","award":["2024-0-50004"],"award-info":[{"award-number":["2024-0-50004"]}],"id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea(NRF)","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,2,16]]},"DOI":"10.1109\/isscc49661.2025.10904707","type":"proceedings-article","created":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T18:33:12Z","timestamp":1741285992000},"page":"144-146","source":"Crossref","is-referenced-by-count":5,"title":["7.5 A 353mW 112Gb\/s Discrete Multitone Wireline Receiver Datapath with Time-Based ADC in 5nm FinFET"],"prefix":"10.1109","author":[{"given":"Jaewon","family":"Lee","sequence":"first","affiliation":[{"name":"Daegu Gyeongbuk Institute of Science and Technology,Daegu,Korea"}]},{"given":"Pier-Andrea","family":"Francese","sequence":"additional","affiliation":[{"name":"IBM Research Europe,Rüuschlikon,Switzerland"}]},{"given":"Matthias","family":"Br\u00e4ndli","sequence":"additional","affiliation":[{"name":"IBM Research Europe,Rüuschlikon,Switzerland"}]},{"given":"Thomas","family":"Morf","sequence":"additional","affiliation":[{"name":"IBM Research Europe,Rüuschlikon,Switzerland"}]},{"given":"Marcel","family":"Kossel","sequence":"additional","affiliation":[{"name":"IBM Research Europe,Rüuschlikon,Switzerland"}]},{"given":"Seoyoung","family":"Jang","sequence":"additional","affiliation":[{"name":"Daegu Gyeongbuk Institute of Science and Technology,Daegu,Korea"}]},{"given":"Gain","family":"Kim","sequence":"additional","affiliation":[{"name":"Daegu Gyeongbuk Institute of Science and Technology,Daegu,Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063081"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366030"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731650"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067613"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731794"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2803735"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2022.3173686"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454537"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365853"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2020.3040947"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2022.3189550"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3234920"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2008.2010061"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIT.1972.1054840"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2938414"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830308"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067745"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062986"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662412"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISIT.1998.708791"}],"event":{"name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,2,16]]},"end":{"date-parts":[[2025,2,20]]}},"container-title":["2025 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904417\/10904496\/10904707.pdf?arnumber=10904707","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T06:07:47Z","timestamp":1741327667000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10904707\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2,16]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/isscc49661.2025.10904707","relation":{},"subject":[],"published":{"date-parts":[[2025,2,16]]}}}