{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T17:55:53Z","timestamp":1774720553317,"version":"3.50.1"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,2,16]]},"DOI":"10.1109\/isscc49661.2025.10904740","type":"proceedings-article","created":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T13:33:12Z","timestamp":1741267992000},"page":"438-440","source":"Crossref","is-referenced-by-count":4,"title":["24.6 A Power- and Area-Efficient 4nm Self-Calibrated 12b\/16GS\/s Hierarchical Time-Interleaving ADC"],"prefix":"10.1109","author":[{"given":"Cheng-En","family":"Hsieh","sequence":"first","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gabriele","family":"Manganaro","sequence":"additional","affiliation":[{"name":"MediaTek,Woburn,MA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng-Hui","family":"Liao","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jack","family":"Weng","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tsun-Yuan","family":"Fan","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alec","family":"Chin","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tsung-Chih","family":"Hung","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jonathan X","family":"Wu","sequence":"additional","affiliation":[{"name":"MediaTek,Woburn,MA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chi-Lun","family":"Lo","sequence":"additional","affiliation":[{"name":"MediaTek,Woburn,MA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andy","family":"Pan","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ming-Hang","family":"Hsieh","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yun-Shiang","family":"Shu","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei-Hsin","family":"Tseng","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuan-Dar","family":"Chen","sequence":"additional","affiliation":[{"name":"MediaTek,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067793"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454350"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830208"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063011"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2747758"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/OJSSCS.2022.3212028"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC51362.2021.9537552"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3195506"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067258"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1049\/PBCS040E"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/DTTIS59576.2023.10348248"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2870529"}],"event":{"name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,2,16]]},"end":{"date-parts":[[2025,2,20]]}},"container-title":["2025 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904417\/10904496\/10904740.pdf?arnumber=10904740","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T19:12:54Z","timestamp":1756753974000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10904740\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2,16]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/isscc49661.2025.10904740","relation":{},"subject":[],"published":{"date-parts":[[2025,2,16]]}}}