{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T17:28:23Z","timestamp":1772645303651,"version":"3.50.1"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,16]],"date-time":"2025-02-16T00:00:00Z","timestamp":1739664000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62474004"],"award-info":[{"award-number":["62474004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100005090","name":"Beijing Nova Program","doi-asserted-by":"publisher","award":["20240484743"],"award-info":[{"award-number":["20240484743"]}],"id":[{"id":"10.13039\/501100005090","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013314","name":"111 project","doi-asserted-by":"publisher","award":["B18001"],"award-info":[{"award-number":["B18001"]}],"id":[{"id":"10.13039\/501100013314","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,2,16]]},"DOI":"10.1109\/isscc49661.2025.10904773","type":"proceedings-article","created":{"date-parts":[[2025,3,6]],"date-time":"2025-03-06T18:33:12Z","timestamp":1741285992000},"page":"314-316","source":"Crossref","is-referenced-by-count":3,"title":["18.5 A Rail-to-Rail 3<sup>rd<\/sup>-Order Noise-Shaping SAR ADC Achieving 105.4dB SFDR with Integrated Input Buffer Using Continuous-Time Correlated Level Shifting"],"prefix":"10.1109","author":[{"given":"Siyuan","family":"Ye","sequence":"first","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Jiajia","family":"Cui","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Jihang","family":"Gao","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Jie","family":"Li","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Xing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]},{"given":"Linxiao","family":"Shen","sequence":"additional","affiliation":[{"name":"Peking University,Beijing,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365990"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731771"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067703"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454362"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454329"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063037"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3006450"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3185501"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2006312"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2013.2281943"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3015863"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3196743"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454412"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067383"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063156"}],"event":{"name":"2025 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,2,16]]},"end":{"date-parts":[[2025,2,20]]}},"container-title":["2025 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10904417\/10904496\/10904773.pdf?arnumber=10904773","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T06:08:43Z","timestamp":1741327723000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10904773\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2,16]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/isscc49661.2025.10904773","relation":{},"subject":[],"published":{"date-parts":[[2025,2,16]]}}}