{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,24]],"date-time":"2026-07-24T20:06:34Z","timestamp":1784923594058,"version":"3.55.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,2]]},"DOI":"10.1109\/isscc49663.2026.11409152","type":"proceedings-article","created":{"date-parts":[[2026,3,3]],"date-time":"2026-03-03T20:50:24Z","timestamp":1772571024000},"page":"272-274","source":"Crossref","is-referenced-by-count":1,"title":["15.10 A Vertical-Cell-Transistor-Based 4F\n                    <sup>2<\/sup>\n                    DRAM with Cell-on-Peripheral Architecture Using Wafer-to-Wafer Hybrid Copper Bonding"],"prefix":"10.1109","author":[{"given":"Hyunchul","family":"Yoon","sequence":"first","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Youngseok","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tae Jin","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Suk Lae","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seungjae","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daesun","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kyunghwan","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yongjun","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"KyuChang","family":"Kang","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bokyeon","family":"Won","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sang-Hoon","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seunghan","family":"Woo","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Donggeon","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jonghyuk","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"In","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junsoo","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jae-Joon","family":"Song","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"InCheol","family":"Nam","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Young-Hun","family":"Seo","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sungsoo","family":"Yim","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jemin","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Changsik","family":"Yoo","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"SangJoon","family":"Hwang","sequence":"additional","affiliation":[{"name":"Samsung Electronics","place":["Hwaseong, Korea"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","first-page":"1.1.1","article-title":"From the future Si technology perspective: Challenges and opportunities","author":"K","year":"2010","journal-title":"IEEE IEDM"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/essderc.2011.6044197"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/vlsitechnologyandcir65189.2025.11075066"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/irps46558.2021.9405115"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2016.7838375"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2025.3531904"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/lssc.2025.3561280"}],"event":{"name":"2026 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2026,2,15]]},"end":{"date-parts":[[2026,2,19]]}},"container-title":["2026 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11408863\/11408946\/11409152.pdf?arnumber=11409152","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,24]],"date-time":"2026-07-24T19:11:49Z","timestamp":1784920309000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11409152\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,2]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/isscc49663.2026.11409152","relation":{},"subject":[],"published":{"date-parts":[[2026,2]]}}}