{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T20:39:30Z","timestamp":1725655170195},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/issoc.2003.1267725","type":"proceedings-article","created":{"date-parts":[[2004,6,21]],"date-time":"2004-06-21T21:52:40Z","timestamp":1087854760000},"page":"93-96","source":"Crossref","is-referenced-by-count":9,"title":["Twisted differential on-chip interconnect architecture for inductive\/capacitive crosstalk noise cancellation"],"prefix":"10.1109","author":[{"given":"I.","family":"Hatirnaz","sequence":"first","affiliation":[]},{"given":"Y.","family":"Leblebici","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","article-title":"GHz Twisted Differential Line Structure on Printed Circuit Board to Minimize EMI and Crosstalk Noises","author":"kam","year":"2002","journal-title":"IEEE Electronic Components and Technology Conf"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2002.807763"},{"key":"ref6","article-title":"A Novel Twisted Differential Line for High-Speed On-Chip Interconnections with Reduced Crosstalk","author":"kam","year":"2002","journal-title":"Proc Electronic Packaging Technology Conf"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2000.896506"},{"key":"ref8","article-title":"NET-AN A Full Three Dimensional Parasitic Interconnect Distributed RCL Extractor For Large Full-Chip Applications","author":"akcasu","year":"1995","journal-title":"IEDM"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/378239.378500"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1147\/rd.165.0470"},{"journal-title":"Circuits Interconnections and Packaging for VLSI","year":"0","author":"bakoglu","key":"ref1"}],"event":{"name":". 2003 International Symposium on System-on-Chip","acronym":"ISSOC-03","location":"Tampere, Finland"},"container-title":["Proceedings. 2003 International Symposium on System-on-Chip (IEEE Cat. No.03EX748)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8954\/28361\/01267725.pdf?arnumber=1267725","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T01:21:28Z","timestamp":1489454488000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1267725\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/issoc.2003.1267725","relation":{},"subject":[]}}