{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T08:54:22Z","timestamp":1725526462708},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/issoc.2004.1411168","type":"proceedings-article","created":{"date-parts":[[2005,3,31]],"date-time":"2005-03-31T18:26:51Z","timestamp":1112293611000},"page":"139-142","source":"Crossref","is-referenced-by-count":2,"title":["Crosstalk immune interconnect driver design"],"prefix":"10.1109","author":[{"given":"R.","family":"Weerasekera","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Li-Rong Zheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Pamunuwa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Tenhunen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"International Technology Roadmap for Semiconductors","year":"2003","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/4.499729"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.813253"},{"journal-title":"Circuits Interconnections and Packaging for VLSI","year":"1990","author":"backoglu","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2004.1268834"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.2000.855281"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1145\/505329.505331"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2002.996695"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2003.810800"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/43.974137"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/5.929648"}],"event":{"name":"2004 International Symposium on System-on-Chip, 2004.","location":"Tampere, Finland"},"container-title":["2004 International Symposium on System-on-Chip, 2004. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9673\/30557\/01411168.pdf?arnumber=1411168","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,14]],"date-time":"2017-03-14T17:43:50Z","timestamp":1489513430000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1411168\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/issoc.2004.1411168","relation":{},"subject":[]}}