{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T00:16:23Z","timestamp":1729642583106,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,6]]},"DOI":"10.1109\/isvdat.2015.7208063","type":"proceedings-article","created":{"date-parts":[[2015,8,20]],"date-time":"2015-08-20T17:53:11Z","timestamp":1440093191000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["A framework for thermal aware reliability estimation in 2D NoC"],"prefix":"10.1109","author":[{"given":"Ashish","family":"Sharma","sequence":"first","affiliation":[]},{"given":"Prachi","family":"Upadhyay","sequence":"additional","affiliation":[]},{"given":"Ruby","family":"Ansar","sequence":"additional","affiliation":[]},{"given":"Vijay","family":"Laxmi","sequence":"additional","affiliation":[]},{"given":"Lava","family":"Bhargava","sequence":"additional","affiliation":[]},{"given":"Manoj Singh","family":"Gaur","sequence":"additional","affiliation":[]},{"given":"Mark","family":"Zwolinski","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Lifetime reliability aware microprocessors","year":"2006","author":"srinivasan","key":"ref4"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"276","DOI":"10.1145\/1028176.1006725","article-title":"The case for lifetime reliability-aware microprocessors","volume":"32","author":"jayanth","year":"2004","journal-title":"SIGARCH Comput Archit News"},{"key":"ref10","doi-asserted-by":"crossref","first-page":"501","DOI":"10.1109\/TVLSI.2006.876103","article-title":"Hotspot: a compact thermal modeling methodology for early-stage vlsi design","volume":"14","author":"wei","year":"2006","journal-title":"Very Large Scale Integration (VLSI) Systems IEEE Transactions on"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2004.1345483"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2013.11.009"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228430"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2091686"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.213"},{"year":"0","key":"ref9"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2002.1176258"}],"event":{"name":"2015 19th International Symposium on VLSI Design and Test (VDAT)","start":{"date-parts":[[2015,6,26]]},"location":"Ahmedabad, India","end":{"date-parts":[[2015,6,29]]}},"container-title":["2015 19th International Symposium on VLSI Design and Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7166536\/7208044\/07208063.pdf?arnumber=7208063","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T14:01:43Z","timestamp":1498226503000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7208063\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/isvdat.2015.7208063","relation":{},"subject":[],"published":{"date-parts":[[2015,6]]}}}