{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,22]],"date-time":"2025-11-22T16:57:57Z","timestamp":1763830677712},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,6]]},"DOI":"10.1109\/isvdat.2015.7208164","type":"proceedings-article","created":{"date-parts":[[2015,8,20]],"date-time":"2015-08-20T21:53:11Z","timestamp":1440107591000},"page":"1-1","source":"Crossref","is-referenced-by-count":9,"title":["Technology scaling and its side effects"],"prefix":"10.1109","author":[{"given":"Aminul","family":"Islam","sequence":"first","affiliation":[]}],"member":"263","event":{"name":"2015 19th International Symposium on VLSI Design and Test (VDAT)","start":{"date-parts":[[2015,6,26]]},"location":"Ahmedabad, India","end":{"date-parts":[[2015,6,29]]}},"container-title":["2015 19th International Symposium on VLSI Design and Test"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7166536\/7208044\/07208164.pdf?arnumber=7208164","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T21:58:45Z","timestamp":1490392725000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7208164\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/isvdat.2015.7208164","relation":{},"subject":[],"published":{"date-parts":[[2015,6]]}}}