{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,9]],"date-time":"2026-01-09T17:29:28Z","timestamp":1767979768035,"version":"3.49.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,20]],"date-time":"2023-06-20T00:00:00Z","timestamp":1687219200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,20]],"date-time":"2023-06-20T00:00:00Z","timestamp":1687219200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,20]]},"DOI":"10.1109\/isvlsi59464.2023.10238597","type":"proceedings-article","created":{"date-parts":[[2023,9,6]],"date-time":"2023-09-06T17:23:19Z","timestamp":1694020999000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["A Digital SRAM Computing-in-Memory Design Utilizing Activation Unstructured Sparsity for High-Efficient DNN Inference"],"prefix":"10.1109","author":[{"given":"Baiqing","family":"Zhong","sequence":"first","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]},{"given":"Mingyu","family":"Wang","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]},{"given":"Chuanghao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]},{"given":"Yangzhan","family":"Mai","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]},{"given":"Xiaojie","family":"Li","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]},{"given":"Zhiyi","family":"Yu","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/71.205650"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2018.00067"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3232648"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3162017"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062958"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3205713"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3172600"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3061508"},{"key":"ref2","first-page":"1","article-title":"A 28nm 29.2 TFLOPS\/W BF16 and 36.5 TOPS\/W INT8 Reconfigurable Digital CIM Processor with Unified FP\/INT Pipeline and Bitwise In-Memory Booth Multiplication For Cloud Deep Learning Acceleration","volume":"65","author":"tu","year":"2022","journal-title":"2022 IEEE Int Solid-State Circuits Conf (ISSCC)"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365766"}],"event":{"name":"2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)","location":"Foz do Iguacu, Brazil","start":{"date-parts":[[2023,6,20]]},"end":{"date-parts":[[2023,6,23]]}},"container-title":["2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10238464\/10238482\/10238597.pdf?arnumber=10238597","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,25]],"date-time":"2023-09-25T18:01:58Z","timestamp":1695664918000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10238597\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,20]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/isvlsi59464.2023.10238597","relation":{},"subject":[],"published":{"date-parts":[[2023,6,20]]}}}