{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,28]],"date-time":"2025-08-28T05:10:21Z","timestamp":1756357821151,"version":"3.44.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,7,6]],"date-time":"2025-07-06T00:00:00Z","timestamp":1751760000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,6]],"date-time":"2025-07-06T00:00:00Z","timestamp":1751760000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100018693","name":"Horizon Europe","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100018693","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,7,6]]},"DOI":"10.1109\/isvlsi65124.2025.11130341","type":"proceedings-article","created":{"date-parts":[[2025,8,27]],"date-time":"2025-08-27T18:20:15Z","timestamp":1756318815000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["3DPlace: Timing-driven Detailed Placement for Monolithic 3D ICs"],"prefix":"10.1109","author":[{"given":"Dimitrios","family":"Vamvakidis","sequence":"first","affiliation":[{"name":"Aristotle University of Thessaloniki,ECE Department,Thessaloniki,Greece"}]},{"given":"Christos","family":"Georgakidis","sequence":"additional","affiliation":[{"name":"University of Thessaly,ECE Department,Volos,Greece"}]},{"given":"Aikaterini","family":"Tsilingiri","sequence":"additional","affiliation":[{"name":"University of Thessaly,ECE Department,Volos,Greece"}]},{"given":"Nikolaos","family":"Sketopoulos","sequence":"additional","affiliation":[{"name":"University of Thessaly,ECE Department,Volos,Greece"}]},{"given":"Christos P.","family":"Sotiriou","sequence":"additional","affiliation":[{"name":"University of Thessaly,ECE Department,Volos,Greece"}]},{"given":"Vasilis F.","family":"Pavlidis","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki,ECE Department,Thessaloniki,Greece"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666604"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2947357.2947363"},{"key":"ref3","first-page":"2022","article-title":"Qualcomm and IMEC Collaborate On 3D Integration Research"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3299874.3319487"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2011.5722210"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967013"},{"key":"ref7","first-page":"1","article-title":"Pin-3D: a physical synthesis and post-layout optimization flow for heterogeneous monolithic 3D ICs","volume-title":"Proceedings of the 39th International Conference on Computer-Aided Design","author":"Pentapati"},{"key":"ref8","first-page":"664","article-title":"TSV-aware analytical placement for 3D IC designs","volume-title":"Proceedings of the 48th Design Automation Conference","author":"Hsu"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796507"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3347293"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342243"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DFT52944.2021.9568290"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560039"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2748025"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2020.05.005"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/b978-0-12-374343-5.x1000-3"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2768330"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI49217.2020.00079"}],"event":{"name":"2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)","start":{"date-parts":[[2025,7,6]]},"location":"Kalamata, Greece","end":{"date-parts":[[2025,7,9]]}},"container-title":["2025 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11129697\/11130193\/11130341.pdf?arnumber=11130341","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,28]],"date-time":"2025-08-28T04:33:20Z","timestamp":1756355600000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11130341\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7,6]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/isvlsi65124.2025.11130341","relation":{},"subject":[],"published":{"date-parts":[[2025,7,6]]}}}