{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T13:01:50Z","timestamp":1725714110877},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,12]],"date-time":"2023-09-12T00:00:00Z","timestamp":1694476800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2023,9,12]],"date-time":"2023-09-12T00:00:00Z","timestamp":1694476800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,12]]},"DOI":"10.1109\/itc-asia58802.2023.10301179","type":"proceedings-article","created":{"date-parts":[[2023,11,1]],"date-time":"2023-11-01T14:07:23Z","timestamp":1698847643000},"page":"1-1","source":"Crossref","is-referenced-by-count":0,"title":["Scalable hierarchical DFT technologies for AI, SOC and multi-die : Tutorial 1"],"prefix":"10.1109","author":[{"given":"Lee","family":"Harrison","sequence":"first","affiliation":[{"name":"Siemens EDA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wu","family":"Yang","sequence":"additional","affiliation":[{"name":"Siemens EDA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2023 IEEE International Test Conference in Asia (ITC-Asia)","start":{"date-parts":[[2023,9,12]]},"location":"Matsue, Japan","end":{"date-parts":[[2023,9,14]]}},"container-title":["2023 IEEE International Test Conference in Asia (ITC-Asia)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10301149\/10301156\/10301179.pdf?arnumber=10301179","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,11,27]],"date-time":"2023-11-27T14:32:42Z","timestamp":1701095562000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10301179\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,12]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/itc-asia58802.2023.10301179","relation":{},"subject":[],"published":{"date-parts":[[2023,9,12]]}}}