{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T19:09:03Z","timestamp":1772824143495,"version":"3.50.1"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,12]],"date-time":"2023-09-12T00:00:00Z","timestamp":1694476800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,12]],"date-time":"2023-09-12T00:00:00Z","timestamp":1694476800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,12]]},"DOI":"10.1109\/itc-asia58802.2023.10301187","type":"proceedings-article","created":{"date-parts":[[2023,11,1]],"date-time":"2023-11-01T18:07:23Z","timestamp":1698862043000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["Design of a Novel Latch with Quadruple-Node-Upset Recovery for Harsh Radiation Hardness"],"prefix":"10.1109","author":[{"given":"Aibin","family":"Yan","sequence":"first","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao","family":"Zhou","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shaojie","family":"Wei","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jie","family":"Cui","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhengfeng","family":"Huang","sequence":"additional","affiliation":[{"name":"Hefei University of Technology,School of Microelectronics,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Patrick","family":"Girard","sequence":"additional","affiliation":[{"name":"University of Montpellier \/ CNRS,Laboratory of Informatics, Robotics and Microelectronics of Montpellier,Montpellier,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Kyushu Institute of Technology,Graduate School of Computer Science and Systems Engineering,Fukuoka,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2016.2634626"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2022.3219372"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2783239"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1999.824159"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/NSSMIC.2008.4774882"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3160448"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2756441"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2008.0099"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2926498"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.3390\/electronics7100247"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-Asia.2019.00037"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2017.2776285"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1587\/elex.15.20180753"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2019.2925448"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2020.3025584"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2022.3216795"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3204827"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-Asia53059.2021.9808802"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2021.3092507"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/DFT52944.2021.9568359"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2018.8602841"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3110135"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2020.2982341"}],"event":{"name":"2023 IEEE International Test Conference in Asia (ITC-Asia)","location":"Matsue, Japan","start":{"date-parts":[[2023,9,12]]},"end":{"date-parts":[[2023,9,14]]}},"container-title":["2023 IEEE International Test Conference in Asia (ITC-Asia)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10301149\/10301156\/10301187.pdf?arnumber=10301187","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,4,13]],"date-time":"2024-04-13T04:27:53Z","timestamp":1712982473000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10301187\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,12]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/itc-asia58802.2023.10301187","relation":{},"subject":[],"published":{"date-parts":[[2023,9,12]]}}}