{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,9]],"date-time":"2026-01-09T23:44:08Z","timestamp":1768002248331,"version":"3.49.0"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,8,18]],"date-time":"2024-08-18T00:00:00Z","timestamp":1723939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,18]],"date-time":"2024-08-18T00:00:00Z","timestamp":1723939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,8,18]]},"DOI":"10.1109\/itc-asia62534.2024.10661343","type":"proceedings-article","created":{"date-parts":[[2024,9,10]],"date-time":"2024-09-10T18:23:28Z","timestamp":1725992608000},"page":"1-5","source":"Crossref","is-referenced-by-count":3,"title":["SRBML: A Single-Event-Upset Recoverable and BTI-Mitigated Latch Design for Long-Term Reliability Enhancement"],"prefix":"10.1109","author":[{"given":"Fan","family":"Xia","sequence":"first","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}]},{"given":"Jing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}]},{"given":"Jehad","family":"Ali","sequence":"additional","affiliation":[{"name":"Ajou University,Department of AI Convergence Network,Suwon,Korea"}]},{"given":"Chunjiong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Ajou University,Department of AI Convergence Network,Suwon,Korea"}]},{"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Kyushu Institute of Technology,Department of Computer Science and Networks,Fukuoka,Japan"}]},{"given":"Aibin","family":"Yan","sequence":"additional","affiliation":[{"name":"Hefei University of Technology,School of Microelectronic,Hefei,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.152"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283821"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2011.6081439"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/1366110.1366121"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2016.2586380"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3024601"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3357312"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2006.320885"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2004.03.019"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397353"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLDI-DAT.2013.6533854"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2007.1070"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2015.2494612"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2020.2966200"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2019.2925448"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397353"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-015-5533-5"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3168082"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1587\/transele.E98.C.1171"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2020.3025584"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/DFT52944.2021.9568359"}],"event":{"name":"2024 IEEE International Test Conference in Asia (ITC-Asia)","location":"Changsha, China","start":{"date-parts":[[2024,8,18]]},"end":{"date-parts":[[2024,8,20]]}},"container-title":["2024 IEEE International Test Conference in Asia (ITC-Asia)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10661305\/10661306\/10661343.pdf?arnumber=10661343","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T09:17:18Z","timestamp":1726046238000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10661343\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,18]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/itc-asia62534.2024.10661343","relation":{},"subject":[],"published":{"date-parts":[[2024,8,18]]}}}