{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:44:14Z","timestamp":1755801854098,"version":"3.44.0"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/itc44170.2019.9000135","type":"proceedings-article","created":{"date-parts":[[2020,2,18]],"date-time":"2020-02-18T06:14:42Z","timestamp":1582006482000},"page":"1-10","source":"Crossref","is-referenced-by-count":8,"title":["IEEE Std. P1687.1: Translator and Protocol"],"prefix":"10.1109","author":[{"given":"Erik","family":"Larsson","sequence":"first","affiliation":[{"name":"Lund University,Lund,Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Prathamesh","family":"Murali","sequence":"additional","affiliation":[{"name":"Lund University,Lund,Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gani","family":"Kumisbek","sequence":"additional","affiliation":[{"name":"Lund University,Lund,Sweden"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2018.2834915"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ReCoSoC.2011.5981520"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2014.6873664"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2017.2731338"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2017.186"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IMS3TW.2015.7177859"},{"key":"ref16","article-title":"A suite of IEEE 1687 benchmark networks","author":"t\u0161ertov","year":"0","journal-title":"International Test Conference (ITC)"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEEESTD.2001.92950"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEEESTD.2014.6974961"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1584044"},{"year":"0","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763228"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.155"},{"key":"ref2","first-page":"1","article-title":"Component manufacturer perspective","author":"posse","year":"0","journal-title":"2015 International Test Conference"},{"journal-title":"Embedded Instrumentation Its Importance and Adoption in the Test and Measurement Marketplace Frost and Sullivan Whitepaper 2010 20 p","year":"0","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401555"}],"event":{"name":"2019 IEEE International Test Conference (ITC)","start":{"date-parts":[[2019,11,9]]},"location":"Washington, DC, USA","end":{"date-parts":[[2019,11,15]]}},"container-title":["2019 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8977396\/9000108\/09000135.pdf?arnumber=9000135","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,20]],"date-time":"2025-08-20T18:38:04Z","timestamp":1755715084000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9000135\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/itc44170.2019.9000135","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}