{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,2]],"date-time":"2025-12-02T15:04:06Z","timestamp":1764687846618},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/itc44170.2019.9000147","type":"proceedings-article","created":{"date-parts":[[2020,2,18]],"date-time":"2020-02-18T11:14:42Z","timestamp":1582024482000},"page":"1-6","source":"Crossref","is-referenced-by-count":19,"title":["Advanced Burn-In - An Optimized Product Stress and Test Flow for Automotive Microcontrollers"],"prefix":"10.1109","author":[{"given":"Chen","family":"He","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Method and Apparatus for Stressing a Non-Volatile Memory","year":"2018","author":"he","key":"ref10"},{"journal-title":"Stress-based Techniques for Detecting an Imminent Read Failure in a Non-Volatile Memory Array","year":"2015","author":"eguchi","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401547"},{"journal-title":"Kernel Based Cluster Fault Analysis","year":"2018","author":"sumikawa","key":"ref13"},{"key":"ref4","article-title":"Burn-in Reduction using Principle Component Analysis","author":"amit","year":"0","journal-title":"Proc International Test Conference (ITC)"},{"key":"ref3","article-title":"Evaluation of effectiveness of median of absolute deviations outlier rejection-based IDDQ testing for burnin reduction","author":"sabade","year":"0","journal-title":"Proc VLSI Test Symposium (VTS)"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401595"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2006.50"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6860619"},{"key":"ref7","article-title":"Reliability and Test over the Product Life Cycle","author":"carulli","year":"0","journal-title":"International Test Conference (ITC) Tutorial"},{"key":"ref2","article-title":"The Effectiveness of IDDQ and High Voltage Stress for Burn-in Elimination","author":"kawahara","year":"0","journal-title":"Proc IEEE International Workshop on IDDQ Testing"},{"journal-title":"Reliability Engineering Theory and Practice","year":"2007","author":"birolini","key":"ref1"},{"key":"ref9","article-title":"Stress-Induced Voiding Under Vias Connected To Wide Ch Metal Leads","author":"ogawa","year":"0","journal-title":"Proc International Reliability Physics Symposium (IRPS)"}],"event":{"name":"2019 IEEE International Test Conference (ITC)","start":{"date-parts":[[2019,11,9]]},"location":"Washington, DC, USA","end":{"date-parts":[[2019,11,15]]}},"container-title":["2019 IEEE International Test Conference (ITC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8977396\/9000108\/09000147.pdf?arnumber=9000147","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:48:22Z","timestamp":1658094502000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9000147\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/itc44170.2019.9000147","relation":{},"subject":[],"published":{"date-parts":[[2019,11]]}}}