{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T11:24:23Z","timestamp":1725794663537},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,6,8]],"date-time":"2023-06-08T00:00:00Z","timestamp":1686182400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,8]],"date-time":"2023-06-08T00:00:00Z","timestamp":1686182400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,6,8]]},"DOI":"10.1109\/iwasi58316.2023.10164511","type":"proceedings-article","created":{"date-parts":[[2023,7,3]],"date-time":"2023-07-03T13:50:24Z","timestamp":1688392224000},"page":"177-182","source":"Crossref","is-referenced-by-count":2,"title":["Automatic tool for real-time estimation of QFN-related heat transfer in multi-layer PCB by using SPICE simulations"],"prefix":"10.1109","author":[{"given":"Giovanni","family":"Mezzina","sequence":"first","affiliation":[{"name":"Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alberto Fakhri","family":"Brunetti","sequence":"additional","affiliation":[{"name":"Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cataldo Luciano","family":"Saragaglia","sequence":"additional","affiliation":[{"name":"Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gianvito","family":"Matarrese","sequence":"additional","affiliation":[{"name":"Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniela De","family":"Venuto","sequence":"additional","affiliation":[{"name":"Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","article-title":"Live Demonstration: A Dry Electrode-Based Brain Computer Interface for P300-Based Car Driving","author":"mezzina","year":"0","journal-title":"56th IEEE International Symposium on Circuits and Systems"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2003.1194771"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.311"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/HLDVT.2016.7748261"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSPIT.2015.7394398"},{"key":"ref2","article-title":"Application Report SNOA967A","author":"kasemsadeh","year":"2019","journal-title":"Temperature sensors PCB guidelines for surface mount devices Texas Instrument"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSE.2015.7247992"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2018.8558128"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/mi13040634"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5456968"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3093098"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/978-981-19-1484-3_17"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1757-899X\/782\/2\/022042"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114118"}],"event":{"name":"2023 9th International Workshop on Advances in Sensors and Interfaces (IWASI)","start":{"date-parts":[[2023,6,8]]},"location":"Monopoli (Bari), Italy","end":{"date-parts":[[2023,6,9]]}},"container-title":["2023 9th International Workshop on Advances in Sensors and Interfaces (IWASI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10164122\/10164290\/10164511.pdf?arnumber=10164511","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,24]],"date-time":"2023-07-24T13:30:17Z","timestamp":1690205417000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10164511\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6,8]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iwasi58316.2023.10164511","relation":{},"subject":[],"published":{"date-parts":[[2023,6,8]]}}}