{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T18:45:11Z","timestamp":1725389111058},"reference-count":12,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iwsoc.2003.1213030","type":"proceedings-article","created":{"date-parts":[[2004,3,1]],"date-time":"2004-03-01T21:26:50Z","timestamp":1078176410000},"page":"175-180","source":"Crossref","is-referenced-by-count":0,"title":["High level modeling and simulation of a VDSL modem in SystemC 2.0-IPsim"],"prefix":"10.1109","author":[{"given":"A.","family":"Armaroli","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Coppola","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.D.","family":"Nava","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.","family":"Fanucci","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Open SystemC Initiative","year":"0","key":"ref4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/12.368014"},{"year":"0","key":"ref10","article-title":"Transmission and Multiplexing (TM) Access transmission systems on metallic access cables Very high speed Digital Subscriber Line (VDSL) Part 2: Transceiver specification"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-4515-6"},{"key":"ref11","article-title":"Zipper-A flexible duplex method for VDSL","author":"isaksson","year":"1997","journal-title":"ANSI T1E1 4\/97&#x2013;016"},{"journal-title":"CynLib CynApps","year":"0","key":"ref5"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2002.1106164"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/35.841831"},{"key":"ref7","article-title":"IPsim Reference Manual","author":"coppola","year":"2001","journal-title":"STMicroelectronics"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/5.97299"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2002.1106165"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/43.31537"}],"event":{"name":"3rd IEEE International Workshop on System-on-Chip for Real-Time Applications","acronym":"IWSOC-03","location":"Calgary, Alta., Canada"},"container-title":["The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications, 2003. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8609\/27279\/01213030.pdf?arnumber=1213030","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T14:57:13Z","timestamp":1489417033000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1213030\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iwsoc.2003.1213030","relation":{},"subject":[]}}