{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T15:29:34Z","timestamp":1725550174943},"reference-count":0,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iwsoc.2003.1213055","type":"proceedings-article","created":{"date-parts":[[2004,4,23]],"date-time":"2004-04-23T18:38:15Z","timestamp":1082745495000},"page":"316-319","source":"Crossref","is-referenced-by-count":1,"title":["The glue in a confident SoC flow"],"prefix":"10.1109","author":[{"given":"J.","family":"Ferguson","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"3rd IEEE International Workshop on System-on-Chip for Real-Time Applications","acronym":"IWSOC-03","location":"Calgary, Alta., Canada"},"container-title":["The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications, 2003. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8609\/27279\/01213055.pdf?arnumber=1213055","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T18:22:08Z","timestamp":1489429328000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1213055\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/iwsoc.2003.1213055","relation":{},"subject":[]}}