{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,30]],"date-time":"2025-05-30T12:42:58Z","timestamp":1748608978803,"version":"3.37.3"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["MOST 107-2218-E-006-043","MOST 106-2221-E-006-038-MY3"],"award-info":[{"award-number":["MOST 107-2218-E-006-043","MOST 106-2221-E-006-038-MY3"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Emerg. Sel. Topics Circuits Syst."],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/jetcas.2018.2881968","type":"journal-article","created":{"date-parts":[[2018,11,21]],"date-time":"2018-11-21T20:05:43Z","timestamp":1542830743000},"page":"122-132","source":"Crossref","is-referenced-by-count":8,"title":["An Assigned Color Depth Packing Method With Centralized Texture Depth Packing Formats for 3D VR Broadcasting Services"],"prefix":"10.1109","volume":"9","author":[{"given":"Wei-Jong","family":"Yang","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3024-5634","authenticated-orcid":false,"given":"Jar-Ferr","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Guan-Cheng","family":"Chen","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8660-570X","authenticated-orcid":false,"given":"Pau-Choo","family":"Chung","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3830-1621","authenticated-orcid":false,"given":"Ming-Fen","family":"Chung","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"2018","author":"yang","journal-title":"Centralized Texture-Depth Packing (CTDP) SEI Message","key":"ref33"},{"year":"2018","journal-title":"Unity Unity 5 0","key":"ref32"},{"year":"2018","journal-title":"Epic Games Unreal Engine 4 Documentation","key":"ref31"},{"year":"2001","author":"bjontegaard","journal-title":"Calculation of Average PSNR Differences Between RD-Curves","key":"ref30"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/TCSVT.2009.2020478"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/MSP.2007.905702"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/JSTSP.2012.2204723"},{"key":"ref13","first-page":"50","article-title":"Depth image-based rendering with edge-oriented hole filling for multiviewsynthesis","author":"yang","year":"2012","journal-title":"Proc Int Conf 3D Syst Appl"},{"year":"2011","author":"carmichael","journal-title":"Using 3D immersive technologies for organizational development and collaboration","key":"ref14"},{"year":"2017","author":"kaiser","article-title":"For more companies, new ways of seeing—Momentum is building for augmented and virtual reality in the enterprise","key":"ref15"},{"key":"ref16","article-title":"The future: Now streaming","author":"focci","year":"2016","journal-title":"Indian Media and Entertainment Industrial Report"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/TDPVT.2002.1024077"},{"key":"ref18","doi-asserted-by":"crossref","first-page":"93","DOI":"10.1117\/12.524762","article-title":"Depth-image-based rendering (DIBR), compression, and transmission for a new approach on 3D-TV","volume":"5291","author":"fehn","year":"2004","journal-title":"Proc SPIE"},{"key":"ref19","first-page":"482","article-title":"A 3D-TV approach using depth-image-based rendering (DIBR)","author":"fehn","year":"2003","journal-title":"Proc Visual Imag Image Process"},{"year":"2013","author":"flynn","journal-title":"Common Test Conditions and Software Reference Configurations for HEVC Range Extensions","key":"ref28"},{"year":"2007","journal-title":"Signaling of Stereoscopic Video in MPEG-2 Systems","key":"ref4"},{"year":"2013","author":"bross","journal-title":"High Efficiency video coding (HEVC) text specification draft 10 (for FDIS & consent)","key":"ref27"},{"year":"2017","author":"yang","journal-title":"Conceptual Study of Potential Centralized Texture Depth Packing SEI Message","key":"ref3"},{"year":"2012","journal-title":"Stereoscopic 3D PSI Signaling","key":"ref6"},{"year":"2013","author":"rusanovskyy","journal-title":"Common Test Conditions of 3DV Core Experiments","key":"ref29"},{"year":"2000","journal-title":"Frame Packing Arrangement Signalling for 3D Content","key":"ref5"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/TCSVT.2006.882390"},{"year":"2003","journal-title":"Advanced video coding for generic audiovisual services","key":"ref7"},{"year":"2015","author":"yang","journal-title":"Centralized Texture-Depth Packing (CTDP) SEI Message","key":"ref2"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"15","DOI":"10.1109\/TCSVT.2009.2026831","article-title":"FPGA design and implementation of a real-time stereo vision system","volume":"20","author":"jin","year":"2010","journal-title":"IEEE Trans Circuits Syst Video Technol"},{"year":"2013","author":"yang","journal-title":"2D Backwards Compatible Centralized Color-Depth Packing","key":"ref1"},{"year":"2007","journal-title":"Philips 3D solutions 3D interface specifications","first-page":"9","key":"ref20"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/TCSVT.2012.2203734"},{"year":"2013","author":"tech","journal-title":"3D-HEVC Test Model 1","key":"ref21"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1109\/ICCV.2011.6126423"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1109\/JSTSP.2012.2195156"},{"year":"2008","author":"tanimoto","journal-title":"View synthesis algorithm in view synthesis reference software 2 0 (VSRS2 0)","key":"ref26"},{"key":"ref25","doi-asserted-by":"crossref","DOI":"10.1145\/1276377.1276497","article-title":"Joint bilateral upsampling","volume":"26","author":"kopf","year":"2007","journal-title":"ACM Trans Graph"}],"container-title":["IEEE Journal on Emerging and Selected Topics in Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5503868\/8664408\/08542685.pdf?arnumber=8542685","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T20:55:01Z","timestamp":1657745701000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8542685\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":33,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/jetcas.2018.2881968","relation":{},"ISSN":["2156-3357","2156-3365"],"issn-type":[{"type":"print","value":"2156-3357"},{"type":"electronic","value":"2156-3365"}],"subject":[],"published":{"date-parts":[[2019,3]]}}}