{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,25]],"date-time":"2026-04-25T08:44:07Z","timestamp":1777106647583,"version":"3.51.4"},"reference-count":61,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T00:00:00Z","timestamp":1638316800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T00:00:00Z","timestamp":1638316800000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/100005801","name":"Facebook","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100005801","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Emerg. Sel. Topics Circuits Syst."],"published-print":{"date-parts":[[2021,12]]},"DOI":"10.1109\/jetcas.2021.3121259","type":"journal-article","created":{"date-parts":[[2021,10,19]],"date-time":"2021-10-19T09:41:55Z","timestamp":1634636515000},"page":"663-676","source":"Crossref","is-referenced-by-count":24,"title":["Near-Sensor Distributed DNN Processing for Augmented and Virtual Reality"],"prefix":"10.1109","volume":"11","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6869-0261","authenticated-orcid":false,"given":"Reid","family":"Pinkham","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0732-1638","authenticated-orcid":false,"given":"Andrew","family":"Berkovich","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5963-9018","authenticated-orcid":false,"given":"Zhengya","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/FCCM.2019.00035"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/FPL.2018.00027"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2015.7298594"},{"key":"ref32","article-title":"Very deep convolutional networks for large-scale image recognition","author":"simonyan","year":"2014","journal-title":"arXiv 1409 1556"},{"key":"ref31","first-page":"1097","article-title":"ImageNet classification with deep convolutional neural networks","author":"krizhevsky","year":"2012","journal-title":"Proc Adv Neural Inf Process Syst"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58526-6_29"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960488"},{"key":"ref36","article-title":"Introduction to the MIPI I3C standardized sensor interface","author":"alliance","year":"2016"},{"key":"ref35","article-title":"Deep compression: Compressing deep neural networks with pruning, trained quantization and Huffman coding","author":"han","year":"2015","journal-title":"arXiv 1510 00149 [cs]"},{"key":"ref34","article-title":"MobileNets: Efficient convolutional neural networks for mobile vision applications","author":"howard","year":"2017","journal-title":"arXiv 1704 04861"},{"key":"ref60","first-page":"238","article-title":"14.1 A 2.9TOPS\/W deep convolutional neural network SoC in FD-SOI 28 nm for intelligent embedded systems","author":"desoli","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCS.2017.226"},{"key":"ref28","article-title":"Squeezenet: Alexnet-level accuracy with 50x fewer parameters and <0.5 MB model size","author":"iandola","year":"2016","journal-title":"arXiv 1602 07360"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2019.00140"},{"key":"ref29","author":"wu","year":"2019","journal-title":"Detectron2"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2637166.2637230"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993566"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/AVSS.2018.8639121"},{"key":"ref22","author":"vr","year":"2019","journal-title":"Introducing Oculus Quest Our First 6DOF All-in-One VR System"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2019.00042"},{"key":"ref24","article-title":"Hololens 2 research mode as a tool for computer vision research","author":"ungureanu","year":"2020"},{"key":"ref23","author":"kothari","year":"2020","journal-title":"Glass Enterprise Edition 2 Faster and More Helpful"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref25","first-page":"10","article-title":"1.1 Computing&#x2019;s energy problem (and what we can do about it)","author":"horowitz","year":"2014","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/HOTCHIPS.2011.7477494"},{"key":"ref51","first-page":"322","article-title":"A 64 Mb SRAM in 22 nm SOI technology featuring fine-granularity power gating and low-energy power-supply-partition techniques for 37% leakage reduction","author":"pilo","year":"2013","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2778281"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC47752.2019.9041955"},{"key":"ref57","author":"rutledge","year":"2021","journal-title":"Introducing Coral Our Platform for Development With Local AI"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2731776"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062955"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/VLSICircuits18222.2020.9163014"},{"key":"ref52","first-page":"316","article-title":"A 20 nm 112 MB SRAM in high-$\\kappa$\n metal-gate with assist circuitry for low-leakage and low-$\\text{V}_{\\textrm{MIN}}$\n applications","author":"chang","year":"2013","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2016.7783723"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001138"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268317"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2019.2910232"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3037697.3037702"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2017.29"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/3173162.3173176"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA51647.2021.00016"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/3093337.3037698"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/3349614.3356023"},{"key":"ref4","year":"2020","journal-title":"Sony to Release World&#x2019;s First Intelligent Vision Sensors with AI Processing Functionality"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/AIVR50618.2020.00040"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2541940.2541967"},{"key":"ref5","year":"2019","journal-title":"Qualcomm Snapdragon 865 5G Mobile Platform Product Brief"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001177"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2014.58"},{"key":"ref49","first-page":"432","article-title":"25.2 A 1.2 V 8Gb 8-channel 128 GB\/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I\/O test methods using 29 nm process and TSV","author":"lee","year":"2014","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001163"},{"key":"ref46","first-page":"102","article-title":"5.5 A 2.1e? temporal noise and ?105 dB parasitic light sensitivity backside-illuminated $2.3~\\mu\\text{m}$\n-pixel voltage-domain global shutter CMOS image sensor using high-capacity DRAM capacitor technology","author":"lee","year":"2020","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref45","year":"2020","journal-title":"1 Megapixel and Below"},{"key":"ref48","first-page":"346","article-title":"25.2 A 16 Gb sub-1 V 7.14 Gb\/s\/pin LPDDR5 SDRAM applying a mosaic architecture with a short-feedback 1-tap DFE, an FSS bus with low-level swing and an adaptively controlled body biasing in a 3rd-generation 10 nm DRAM","author":"kim","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref47","first-page":"16.4.1","article-title":"A 2.2 $\\mu\\text{m}$\n stacked back side illuminated voltage domain global shutter CMOS image sensor","author":"park","year":"2019","journal-title":"IEDM Tech Dig"},{"key":"ref42","year":"2014","journal-title":"4Gb x4 x8 x16 DDR3L SDRAM"},{"key":"ref41","first-page":"1","article-title":"A $6.9~\\mu\\text{m}$\n pixel-pitch 3D stacked global shutter CMOS image sensor with 3M Cu-Cu connections","author":"miura","year":"2019","journal-title":"Proc Int Conf 3D Syst Integr"},{"key":"ref44","first-page":"154","article-title":"9.6 A 1\/2.3inch 12.3 Mpixel with on-chip 4.97TOPS\/W CNN processor back-illuminated stacked CMOS image sensor","author":"eki","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref43","author":"vr","year":"2020","journal-title":"Introducing Oculus Quest 2 the Next Generation of All-in-One VR"}],"container-title":["IEEE Journal on Emerging and Selected Topics in Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5503868\/9647029\/09579429.pdf?arnumber=9579429","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,3,14]],"date-time":"2022-03-14T21:36:21Z","timestamp":1647293781000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9579429\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,12]]},"references-count":61,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/jetcas.2021.3121259","relation":{},"ISSN":["2156-3357","2156-3365"],"issn-type":[{"value":"2156-3357","type":"print"},{"value":"2156-3365","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,12]]}}}