{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,21]],"date-time":"2025-12-21T06:26:35Z","timestamp":1766298395668,"version":"3.37.3"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Emerg. Sel. Topics Circuits Syst."],"published-print":{"date-parts":[[2023,6]]},"DOI":"10.1109\/jetcas.2023.3278843","type":"journal-article","created":{"date-parts":[[2023,6,13]],"date-time":"2023-06-13T17:19:05Z","timestamp":1686676745000},"page":"457-460","source":"Crossref","is-referenced-by-count":2,"title":["Guest Editorial Circuits and Systems for Industry X.0 Applications"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3306-6148","authenticated-orcid":false,"given":"Chi-Tsun","family":"Cheng","sequence":"first","affiliation":[{"name":"Department of Manufacturing, Materials and Mechatronics, School of Engineering, RMIT University, Melbourne, VIC, Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J\u00f6rg","family":"Wollert","sequence":"additional","affiliation":[{"name":"Faculty of Mechanical Engineering and Mechatronics, FH Aachen&#x2013;Aachen University of Applied Sciences, Aachen, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3135-4114","authenticated-orcid":false,"given":"Xi","family":"Chen","sequence":"additional","affiliation":[{"name":"State Grid U.S. Representative Office, New York, NY, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2577-3416","authenticated-orcid":false,"given":"Abraham O.","family":"Fapojuwo","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, University of Calgary, Calgary, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","container-title":["IEEE Journal on Emerging and Selected Topics in Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5503868\/10149835\/10149841.pdf?arnumber=10149841","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,14]],"date-time":"2023-06-14T17:23:18Z","timestamp":1686763398000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10149841\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6]]},"references-count":0,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jetcas.2023.3278843","relation":{},"ISSN":["2156-3357","2156-3365"],"issn-type":[{"type":"print","value":"2156-3357"},{"type":"electronic","value":"2156-3365"}],"subject":[],"published":{"date-parts":[[2023,6]]}}}