{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,7]],"date-time":"2026-02-07T22:33:58Z","timestamp":1770503638831,"version":"3.49.0"},"reference-count":17,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2009,1,1]],"date-time":"2009-01-01T00:00:00Z","timestamp":1230768000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Proc. IEEE"],"published-print":{"date-parts":[[2009,1]]},"DOI":"10.1109\/jproc.2008.2007464","type":"journal-article","created":{"date-parts":[[2009,3,5]],"date-time":"2009-03-05T23:48:05Z","timestamp":1236296885000},"page":"60-69","source":"Crossref","is-referenced-by-count":31,"title":["System on Wafer: A New Silicon Concept in SiP"],"prefix":"10.1109","volume":"97","author":[{"given":"Gilles","family":"Poupon","sequence":"first","affiliation":[]},{"given":"Nicolas","family":"Sillon","sequence":"additional","affiliation":[]},{"given":"David","family":"Henry","sequence":"additional","affiliation":[]},{"given":"Charlotte","family":"Gillot","sequence":"additional","affiliation":[]},{"given":"Alan","family":"Mathewson","sequence":"additional","affiliation":[]},{"given":"Lea","family":"Di Cioccio","sequence":"additional","affiliation":[]},{"given":"Barbara","family":"Charlet","sequence":"additional","affiliation":[]},{"given":"Patrick","family":"Leduc","sequence":"additional","affiliation":[]},{"given":"Maud","family":"Vinet","sequence":"additional","affiliation":[]},{"given":"Perrine","family":"Batude","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2005.846580"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2006.10.052"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2007.382355"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2007.382392"},{"key":"ref14","year":"0","journal-title":"Photonic interconnect layer on CMOS by wafer-scale integration (PICMOS)"},{"key":"ref15","article-title":"new heterostructures and 3d devices obtained by the bonding and thinning technique","author":"di cioccio","year":"0","journal-title":"Proc 210th ECS Wafer Bonding Conf 2006"},{"key":"ref16","year":"0","journal-title":"Circuit intgr tridimensionnel de type CMOS et procd de fabrication"},{"key":"ref17","article-title":"self assembly of die to wafer using direct bonding methods and capillarity techniques","author":"grossi","year":"0","journal-title":"Proc IMAPS 2006"},{"key":"ref4","article-title":"micropackaging technologies for integrated microsystems: applications to mems and moems","author":"najafi","year":"2003","journal-title":"Proc SPIE Micromach Microfab Process Technol"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2005.1441291"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2006.280052"},{"key":"ref5","article-title":"wafer level hermetic packaging for above-ic rf mems: process and characterization","author":"gillot","year":"2004","journal-title":"Proc IMAPS Int Workshop Microelectron"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1147\/rd.494.0621"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2006.279989"},{"key":"ref2","article-title":"innovative flip chip solution for system on wafer concept","author":"sillon","year":"2005","journal-title":"Proc 3S Workshop"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/EMAP.2002.1188809"},{"key":"ref9","first-page":"102","article-title":"copper interconnections for high performance and fine pitch flip-chip digital applications and ultra-miniaturized rf module applications","author":"tummala","year":"2006","journal-title":"Proc IEEE ECTC"}],"container-title":["Proceedings of the IEEE"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5\/4796865\/04796876.pdf?arnumber=4796876","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T00:00:41Z","timestamp":1633910441000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4796876\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,1]]},"references-count":17,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/jproc.2008.2007464","relation":{},"ISSN":["0018-9219"],"issn-type":[{"value":"0018-9219","type":"print"}],"subject":[],"published":{"date-parts":[[2009,1]]}}}