{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,16]],"date-time":"2026-06-16T05:02:17Z","timestamp":1781586137792,"version":"3.54.5"},"reference-count":91,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2010,12,1]],"date-time":"2010-12-01T00:00:00Z","timestamp":1291161600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Proc. IEEE"],"published-print":{"date-parts":[[2010,12]]},"DOI":"10.1109\/jproc.2010.2068030","type":"journal-article","created":{"date-parts":[[2010,11,5]],"date-time":"2010-11-05T19:09:31Z","timestamp":1288984171000},"page":"2015-2031","source":"Crossref","is-referenced-by-count":93,"title":["Carbon Nanotubes for VLSI: Interconnect and Transistor Applications"],"prefix":"10.1109","volume":"98","author":[{"given":"Yuji","family":"Awano","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shintaro","family":"Sato","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mizuhisa","family":"Nihei","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tadashi","family":"Sakai","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yutaka","family":"Ohno","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takashi","family":"Mizutani","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref73","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2005.858601"},{"key":"ref72","doi-asserted-by":"publisher","DOI":"10.1063\/1.1612904"},{"key":"ref71","doi-asserted-by":"publisher","DOI":"10.1063\/1.1368869"},{"key":"ref70","doi-asserted-by":"crossref","first-page":"1735","DOI":"10.1126\/science.1122797","article-title":"an integrated logic circuit assembled on a single carbon nanotube","volume":"311","author":"chen","year":"2006","journal-title":"Science"},{"key":"ref76","doi-asserted-by":"publisher","DOI":"10.1002\/ange.200460356"},{"key":"ref77","doi-asserted-by":"crossref","first-page":"433","DOI":"10.1016\/j.cplett.2005.04.054","article-title":"aligned growth of isolated single-walled carbon nanotubes programmed by atomic arrangement of substrate surface","volume":"408","author":"ago","year":"2005","journal-title":"Chem Phys Lett"},{"key":"ref74","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2008.04.028"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/NANONET.2006.346235"},{"key":"ref75","doi-asserted-by":"publisher","DOI":"10.1063\/1.3155212"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546953"},{"key":"ref78","doi-asserted-by":"publisher","DOI":"10.1002\/smll.200500120"},{"key":"ref79","doi-asserted-by":"publisher","DOI":"10.1063\/1.2969290"},{"key":"ref33","author":"baron","year":"2001","journal-title":"Aerosol Measurement Principles Techniques and Application"},{"key":"ref32","doi-asserted-by":"crossref","first-page":"149","DOI":"10.1016\/j.cplett.2004.12.018","article-title":"Carbon nanotube growth from titanium–cobalt bimetallic particles as a catalyst","volume":"402","author":"sato","year":"2005","journal-title":"Chem Phys Lett"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.cplett.2003.10.076"},{"key":"ref30","doi-asserted-by":"crossref","first-page":"3611","DOI":"10.1002\/pssa.200622415","article-title":"carbon nanotube via interconnect technologies: size-classified catalyst nanoparticles and low-resistance ohmic contact formation","volume":"203","author":"awano","year":"2006","journal-title":"Phys Stat Sol (a)"},{"key":"ref37","first-page":"18","article-title":"feasibility study of novel molecular pore-stacking (mps), sioch film in fully-scale-down 45 nm node cu damascene interconnects","author":"tada","year":"2005","journal-title":"Proc Very Large Scale Integration Tech Symp"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2009.5090336"},{"key":"ref35","first-page":"5k","article-title":"synthesis of a closely packed multi-walled carbon nanotube forest by a multi-step plasma chemical vapor deposition growth method","author":"yamazaki","year":"2009","journal-title":"Proc Mater Res Soc Fall Meeting"},{"key":"ref34","author":"awano","year":"0","journal-title":"Carbon nanotube interconnect technologies"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.200723528"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1116\/1.3054266"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/55.553049"},{"key":"ref63","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2007.914069"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546977"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1021\/nl0508624"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2007.382390"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/17\/14\/011"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1126\/science.290.5496.1552"},{"key":"ref29","first-page":"140","article-title":"carbon nanotube via technologies for advanced interconnect integration","author":"nihei","year":"2006","journal-title":"Proc Int Conf Solid State Devices Mater"},{"key":"ref67","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.61.R10606"},{"key":"ref68","doi-asserted-by":"crossref","first-page":"453","DOI":"10.1021\/nl015606f","article-title":"carbon nanotube inter- and intramolecular logic gates","volume":"1","author":"derycke","year":"2001","journal-title":"Nano Lett"},{"key":"ref69","doi-asserted-by":"publisher","DOI":"10.1021\/nl0717107"},{"key":"ref2","author":"saito","year":"2000","journal-title":"Physical Properties of Carbon Nanotubes"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/354056a0"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9317(02)00814-6"},{"key":"ref22","doi-asserted-by":"crossref","first-page":"1626","DOI":"10.1143\/JJAP.44.1626","article-title":"electrical properties of carbon nanotube bundles for future via interconnects","volume":"44","author":"nihei","year":"2005","journal-title":"Jpn J Appl Phys"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1063\/1.1496494"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.diamond.2007.10.028"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1002\/pssb.200879553"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2006.1648696"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1143\/APEX.1.034004"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1149\/1.1862474"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1063\/1.1448850"},{"key":"ref91","article-title":"nearly closest packing structure of carbon nanotube, tem-eels analysis of catalyst metals for high-density carbon nanotube growth","author":"kawabata","year":"2010","journal-title":"Proc Int Conf Sci Appl Nanotubes"},{"key":"ref90","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.45.5501"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/21\/16\/165201"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/18\/41\/415202"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/16.141237"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.89.106801"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1063\/1.1888054"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2005.851427"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1063\/1.1865343"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.87.256805"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609320"},{"key":"ref11","first-page":"2","article-title":"on-chip differential transmission-line (dtl) interconnect for 22 nm technology","author":"okada","year":"2006","journal-title":"Proc Adv Metallization Conf"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1093\/ietele\/e89-c.11.1499"},{"key":"ref12","author":"hutchby","year":"2008","journal-title":"Emerging research devices ITRS Public Conf"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/19\/43\/435601"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609322"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/RFIT.2009.5383724"},{"key":"ref82","doi-asserted-by":"crossref","first-page":"10287","DOI":"10.1021\/ja051774o","article-title":"Large-scale separation of metallic and semiconducting single-walled carbon nanotubes","volume":"127","author":"maeda","year":"2005","journal-title":"J Amer Chem Soc"},{"key":"ref16","first-page":"1390","article-title":"carbon nanotube bumps for lsi interconnect","author":"soga","year":"2008","journal-title":"Proc Electron Compon Technol Conf"},{"key":"ref81","doi-asserted-by":"publisher","DOI":"10.1126\/science.1086534"},{"key":"ref17","first-page":"1","article-title":"interconnect wg","year":"2009","journal-title":"Proc ITRS Winter Conf"},{"key":"ref84","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2006.52"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2004.1345767"},{"key":"ref83","doi-asserted-by":"publisher","DOI":"10.1038\/nmat877"},{"key":"ref19","first-page":"234","article-title":"low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells","author":"nihei","year":"2005","journal-title":"Proc IEEE Int Interconnect Technol Conf"},{"key":"ref80","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2009.355"},{"key":"ref89","doi-asserted-by":"publisher","DOI":"10.1021\/nn100337t"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.87.106801"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.84.2941"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.43.7337"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.87.215502"},{"key":"ref85","doi-asserted-by":"publisher","DOI":"10.1021\/nl8034866"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.1840096"},{"key":"ref86","doi-asserted-by":"publisher","DOI":"10.1007\/s12274-009-9016-9"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/381678a0"},{"key":"ref49","doi-asserted-by":"crossref","first-page":"699","DOI":"10.1021\/nl052453d","article-title":"atomic layer deposition on suspended single-walled carbon nanotubes via gas-phase noncovalent functionalization","volume":"6","author":"farmer","year":"2006","journal-title":"Nano Lett"},{"key":"ref87","doi-asserted-by":"publisher","DOI":"10.1038\/nature08116"},{"key":"ref88","doi-asserted-by":"publisher","DOI":"10.1021\/nl0703727"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2004.1419265"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.98.186808"},{"key":"ref45","author":"sze","year":"2007","journal-title":"Physics of Semiconductor Devices"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1021\/ja058836v"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1038\/nmat769"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546961"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424292"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.94.086802"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424381"}],"container-title":["Proceedings of the IEEE"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5\/5628287\/05609178.pdf?arnumber=5609178","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T00:44:14Z","timestamp":1633913054000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5609178\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,12]]},"references-count":91,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/jproc.2010.2068030","relation":{},"ISSN":["0018-9219","1558-2256"],"issn-type":[{"value":"0018-9219","type":"print"},{"value":"1558-2256","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,12]]}}}