{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T09:01:14Z","timestamp":1767085274043},"reference-count":84,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2013,2,1]],"date-time":"2013-02-01T00:00:00Z","timestamp":1359676800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Proc. IEEE"],"published-print":{"date-parts":[[2013,2]]},"DOI":"10.1109\/jproc.2012.2220312","type":"journal-article","created":{"date-parts":[[2012,11,14]],"date-time":"2012-11-14T19:02:39Z","timestamp":1352919759000},"page":"451-472","source":"Crossref","is-referenced-by-count":39,"title":["Skin-Effect Loss Models for Time- and Frequency-Domain PEEC Solver"],"prefix":"10.1109","volume":"101","author":[{"given":"Albert E.","family":"Ruehli","sequence":"first","affiliation":[]},{"given":"Giulio","family":"Antonini","sequence":"additional","affiliation":[]},{"given":"Li Jun","family":"Jiang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref73","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.891089"},{"key":"ref72","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2005.856350"},{"key":"ref71","doi-asserted-by":"publisher","DOI":"10.1109\/43.931029"},{"key":"ref70","author":"pillegi","year":"1995","journal-title":"Electronic Circuits and System Simulation Methods"},{"key":"ref76","first-page":"203","article-title":"Interconnect electromagnetic modeling using conduction models as global basis function","volume":"9","author":"white","year":"2000","journal-title":"Dig Electr Perf Electron Packag"},{"key":"ref77","doi-asserted-by":"publisher","DOI":"10.1049\/piee.1964.0272"},{"key":"ref74","first-page":"831","article-title":"Efficiency mid-frequency plane inductance computations","author":"zhou","year":"2010","journal-title":"Proc IEEE Int Symp Electromagn Compat"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JRPROC.1942.232015"},{"key":"ref75","author":"grover","year":"1962","journal-title":"Inductance Calculations Working Formulas and Tables"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2011.6038319"},{"key":"ref78","author":"paul","year":"2010","journal-title":"Inductance Loop and Partial"},{"key":"ref79","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEurope.2012.6396927"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.852766"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2009.2023629"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2005.861580"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.891089"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/22.868992"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2000.875582"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2010.2087350"},{"key":"ref34","first-page":"1423","article-title":"Combined loss mechanism and stability model for the partial element equivalent circuit technique","author":"antonini","year":"2007","journal-title":"Proc Appl Comput Electromagn Conf"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2010.2089789"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2007.147"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.1980.1124303"},{"key":"ref63","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2011.6038367"},{"key":"ref28","first-page":"1334","article-title":"Fast extraction for 3-D inductance and resistance in interconnects","author":"yang","year":"2002","journal-title":"Proc Int Conf Commun Circuits Syst"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1109\/MAP.2009.4939019"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.1999.819223"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.1997.604521"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1109\/15.809841"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2005.1563778"},{"key":"ref67","first-page":"504","article-title":"The modified nodal approach to network analysis","volume":"cas 22","author":"ho","year":"1975","journal-title":"IEEE Trans Circuit Syst"},{"key":"ref68","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2007.897129"},{"key":"ref69","author":"celik","year":"2002","journal-title":"IC Interconnect Analysis"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/9780470892329"},{"key":"ref1","author":"chew","year":"2001","journal-title":"Fast and Efficient Algorithms in Computational Electromagnetics"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1974.1128204"},{"key":"ref22","doi-asserted-by":"crossref","first-page":"678","DOI":"10.1145\/157485.165090","article-title":"fasthenry: a multipole-accelerated 3-d inductance extraction program","author":"kamon","year":"1993","journal-title":"30th ACM\/IEEE Design Automation Conference"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1147\/rd.236.0661"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.1982.1142818"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2005.859898"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/EMCEUROPE.2008.4786892"},{"key":"ref25","first-page":"292","article-title":"Efficient 3-D series impedance extraction using effective internal impedance","volume":"4","author":"tuncer","year":"1995","journal-title":"Dig Electr Perf Electron Packag"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2010.2043514"},{"key":"ref51","first-page":"2700","article-title":"Generalized impedance boundary condition","author":"qian","year":"2007","journal-title":"Proc Antennas Propag Soc Int Symp"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2007.4387127"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373887"},{"key":"ref57","first-page":"675","article-title":"Fastsies: A fast stochastic integral equation solver for modeling the rough surface effect","author":"zhu","year":"2005","journal-title":"Proc Int Conf Comput Aided Design"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1002\/0471224278"},{"key":"ref55","first-page":"139","article-title":"Gradient resistivity method for numerical evaluation of anomalous skin effect","author":"tsuhiya","year":"2011","journal-title":"Proc IEEE Workshop Signal Propag Interconnects"},{"key":"ref54","author":"matick","year":"1969","journal-title":"Transmission Lines for Digital and Communication Networks"},{"key":"ref53","first-page":"2801","article-title":"Generalized impedance boundary condition","author":"qian","year":"2007","journal-title":"Proc IEEE Antennas Propag Soc Int Symp"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2010.2078473"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/22.85409"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/22.588594"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1002\/9780470682425"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"167","DOI":"10.1109\/TEMC.2003.810804","article-title":"Non-orthoganal PEEC formulation for time and frequency domain EM and circuit modeling","volume":"45","author":"ruehli","year":"2003","journal-title":"Proc IEEE Int Symp Electromagn Compat"},{"key":"ref13","first-page":"563","article-title":"Using conduction modes as global basis functions for efficient electromagnetic analysis of on-chip interconnect","author":"sangiovanni-vincentelli","year":"2001","journal-title":"Proc Design Autom Conf"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2002.1167554"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/22.954771"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2000.906398"},{"key":"ref82","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1975.1128653"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2004.825467"},{"key":"ref81","author":"pinello","year":"1999","journal-title":"Personal Communication With A Ruehli"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2007.895984"},{"key":"ref84","doi-asserted-by":"publisher","DOI":"10.1109\/COMPEL.2008.4634684"},{"key":"ref19","author":"ramo","year":"1994","journal-title":"Fields and Waves in Communication Electronics"},{"key":"ref83","first-page":"177","article-title":"Skin-effect model for round wires in PEEC","author":"ruehli","year":"2011","journal-title":"Dig Electr Perf Electronic Packaging"},{"key":"ref80","doi-asserted-by":"publisher","DOI":"10.1002\/jnm.669"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/5.929652"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1049\/PBEW038E"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"248","DOI":"10.1109\/TEMC.2010.2048755","article-title":"Review of EMC analysis technologies for packaging, PCB and novel interconnects","volume":"52","author":"li","year":"2010","journal-title":"IEEE Trans Electromagn Compat"},{"key":"ref5","author":"swaminathan","year":"2007","journal-title":"Power Integrity Modeling and Design for Semiconductors and Systems"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1982.12381"},{"key":"ref7","author":"paul","year":"2008","journal-title":"Analysis of Multiconductor Transmission Lines"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2006.875796"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/22.85374"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.1986.1143894"},{"key":"ref45","first-page":"71","article-title":"Electromagnetic scattering from a homogeneous material body of revolution","volume":"33","author":"mautz","year":"1979","journal-title":"Arch Elek Uebertagung"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2004.836430"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/8.736628"},{"key":"ref42","author":"chew","year":"1995","journal-title":"Waves and Fields in Inhomogeneous Media"},{"key":"ref41","first-page":"263","article-title":"Mixed volume and surface PEEC circuit and electromagnetic solver","volume":"16","author":"ruehli","year":"2005","journal-title":"Proc Int Zurich Symp Electromagn Compat"},{"key":"ref44","author":"poggio","year":"1973","journal-title":"PMCHWT combined integral equation formulation named after the contributors"},{"key":"ref43","author":"balanis","year":"1989","journal-title":"Advanced Engineering Electromagnetics"}],"container-title":["Proceedings of the IEEE"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5\/6413192\/06353491.pdf?arnumber=6353491","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:23:15Z","timestamp":1638217395000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6353491\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,2]]},"references-count":84,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jproc.2012.2220312","relation":{},"ISSN":["0018-9219","1558-2256"],"issn-type":[{"value":"0018-9219","type":"print"},{"value":"1558-2256","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,2]]}}}