{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T11:35:09Z","timestamp":1770723309916,"version":"3.49.0"},"reference-count":11,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2015,4,1]],"date-time":"2015-04-01T00:00:00Z","timestamp":1427846400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/EU.html"}],"funder":[{"DOI":"10.13039\/100006602","name":"Air Force Research Laboratory","doi-asserted-by":"publisher","award":["FA8650-14-C-50"],"award-info":[{"award-number":["FA8650-14-C-50"]}],"id":[{"id":"10.13039\/100006602","id-type":"DOI","asserted-by":"publisher"}]},{"name":"FlexTech Alliance Development Agreement","award":["RFP13-162"],"award-info":[{"award-number":["RFP13-162"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Proc. IEEE"],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/jproc.2015.2399305","type":"journal-article","created":{"date-parts":[[2015,5,19]],"date-time":"2015-05-19T14:37:02Z","timestamp":1432046222000},"page":"633-643","source":"Crossref","is-referenced-by-count":19,"title":["Enabling Electronics With Physically Flexible ICs and Hybrid Manufacturing"],"prefix":"10.1109","volume":"103","author":[{"given":"Douglas","family":"Hackler","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David G.","family":"Sime","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Steven F.","family":"Wald","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","article-title":"High performance electronics integration in flexible technology","author":"hackler","year":"0","journal-title":"2011FLEX Flexible Electron Displays Conf"},{"key":"ref3","article-title":"Performance electronics integration in flexible technology","author":"chaney","year":"0","journal-title":"GOMAC"},{"key":"ref10","article-title":"Stretching the limits of electronics","author":"koetse","year":"2014","journal-title":"LOPEC 6th Int Exhibit Conf"},{"key":"ref6","article-title":"FleX silicon-on-polymer flexible single crystalline ICs from commercial foundry processes for flexible hybrid systems","author":"hackler","year":"2014","journal-title":"LOPEC 6th Int Exhibit Conf"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s10916-010-9571-3"},{"key":"ref5","article-title":"Flexible hybrid system integration: Combining printed sensors with flexible ICs","author":"hackler","year":"2014","journal-title":"IDTechEX Printed Electronics USA"},{"key":"ref8","article-title":"Assembly and in-mould-integration process development for flexible systems based on chips-on-roll","author":"ronka","year":"2014","journal-title":"LOPEC 6th Int Exhibit Conf"},{"key":"ref7","article-title":"FleX silicon-on-polymer technology","author":"hackler","year":"0","journal-title":"American Semiconductor Inc"},{"key":"ref2","first-page":"29","article-title":"Ultra-thin chips and related applications, A new paradigm in silicon technology","author":"burghartz","year":"0","journal-title":"Proc Eur Solid State Device Res Conf"},{"key":"ref9","article-title":"Developing the supply-chain for NFC enabled flexible electronics","author":"clausen","year":"2014","journal-title":"LOPEC 6th Int Exhibit Conf"},{"key":"ref1","article-title":"3D integration of ultra-thin functional devices inside standard multilayer flex laminates","author":"christiaens","year":"0","journal-title":"Eur Microelectron Packag conf"}],"container-title":["Proceedings of the IEEE"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5\/7110409\/07110432.pdf?arnumber=7110432","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:44:41Z","timestamp":1641987881000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7110432\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":11,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/jproc.2015.2399305","relation":{},"ISSN":["0018-9219","1558-2256"],"issn-type":[{"value":"0018-9219","type":"print"},{"value":"1558-2256","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015,4]]}}}