{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T05:06:19Z","timestamp":1777439179412,"version":"3.51.4"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2009,3,1]],"date-time":"2009-03-01T00:00:00Z","timestamp":1235865600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1109\/jssc.2008.2010997","type":"journal-article","created":{"date-parts":[[2009,2,26]],"date-time":"2009-02-26T18:06:50Z","timestamp":1235671610000},"page":"995-1005","source":"Crossref","is-referenced-by-count":155,"title":["256-Channel Neural Recording and Delta Compression Microsystem With 3D Electrodes"],"prefix":"10.1109","volume":"44","author":[{"given":"Joseph N. Y.","family":"Aziz","sequence":"first","affiliation":[]},{"given":"Karim","family":"Abdelhalim","sequence":"additional","affiliation":[]},{"given":"Ruslana","family":"Shulyzki","sequence":"additional","affiliation":[]},{"given":"Roman","family":"Genov","sequence":"additional","affiliation":[]},{"given":"Berj L.","family":"Bardakjian","sequence":"additional","affiliation":[]},{"given":"Miron","family":"Derchansky","sequence":"additional","affiliation":[]},{"given":"Demitre","family":"Serletis","sequence":"additional","affiliation":[]},{"given":"Peter L.","family":"Carlen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEMBS.2006.260307"},{"key":"ref11","doi-asserted-by":"crossref","DOI":"10.1109\/TBCAS.2007.893181","article-title":"brain-silicon interface for high-resolution in-vitro neural recording","volume":"1","author":"aziz","year":"2007","journal-title":"IEEE Trans Biomed Circuits Syst"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373637"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1994.409266"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2006.1693039"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2007.907868"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405694"},{"key":"ref17","author":"motchenbacher","year":"1993","journal-title":"Low-Noise Electronic System Design"},{"key":"ref18","author":"tsividis","year":"2003","journal-title":"Operation and Modeling of the MOS Transistor"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1987.1052869"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.858479"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.873677"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MEMB.2005.1511497"},{"key":"ref5","first-page":"2258","article-title":"a low-power integrated circuit for a wireless 100-electrode neural recording system","author":"harrison","year":"2006","journal-title":"IEEE Int Conf Solid-State Circuits Dig Tech Papers"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.819174"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2004.831521"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2004.824126"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2006.1693773"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.811979"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1494019"},{"key":"ref22","first-page":"535","article-title":"bump, dip, flip: single chip","author":"riley","year":"1987","journal-title":"Surface Mount Int"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/5.542410"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2006.1692789"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IEMBS.2005.1615648"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2007.378090"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4\/4787550\/04787578.pdf?arnumber=4787578","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:59:23Z","timestamp":1633910363000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4787578\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":25,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2008.2010997","relation":{},"ISSN":["0018-9200"],"issn-type":[{"value":"0018-9200","type":"print"}],"subject":[],"published":{"date-parts":[[2009,3]]}}}