{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,8,28]],"date-time":"2023-08-28T09:32:38Z","timestamp":1693215158481},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2011,2,1]],"date-time":"2011-02-01T00:00:00Z","timestamp":1296518400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2011,2]]},"DOI":"10.1109\/jssc.2010.2091351","type":"journal-article","created":{"date-parts":[[2010,12,14]],"date-time":"2010-12-14T18:21:23Z","timestamp":1292350883000},"page":"498-506","source":"Crossref","is-referenced-by-count":2,"title":["Automatic Compensation of the Voltage Attenuation in 3-D Interconnection Based on Capacitive Coupling"],"prefix":"10.1109","volume":"46","author":[{"given":"Eleonora","family":"Franchi Scarselli","sequence":"first","affiliation":[]},{"given":"Antonio","family":"Gnudi","sequence":"additional","affiliation":[]},{"given":"Federico","family":"Natali","sequence":"additional","affiliation":[]},{"given":"Mauro","family":"Scandiuzzo","sequence":"additional","affiliation":[]},{"given":"Roberto","family":"Canegallo","sequence":"additional","affiliation":[]},{"given":"Roberto","family":"Guerrieri","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.831448"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.885073"},{"key":"ref12","first-page":"186","article-title":"1.27 gb\/s\/pin 3 mw\/pin wireless superconnect (wsc) interface scheme","author":"kanda","year":"2003","journal-title":"IEEE ISSCC 2003 Dig Tech Papers"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.859881"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914762"},{"key":"ref15","first-page":"463","article-title":"system on chip with 1.12 mw 32 gb\/s ac-coupled 3-d memory interface","author":"canegallo","year":"2009","journal-title":"Proc IEEE Custom Integrated Circuits Conf (CICC)"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2009.5325985"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1989.572629"},{"key":"ref18","article-title":"3d assembly technology for hybrid integration of heterogenous devices","author":"jung","year":"2006","journal-title":"Proc Design Test Integration and Packaging (DTIP) of MEMS\/MOEMS 2006 Symp"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1049\/el:20057110"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/DTIP.2008.4752966"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977515"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2012365"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2074070"},{"key":"ref2","first-page":"430","article-title":"system-in-silicon architecture and its application to h.264\/avc motion estimation for 1080 hdtv","author":"kumagai","year":"2006","journal-title":"IEEE ISSCC 2006 Dig Tech Papers"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2040310"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2010.5642690"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4\/5702419\/05664811.pdf?arnumber=5664811","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:47:47Z","timestamp":1633909667000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5664811\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,2]]},"references-count":20,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2010.2091351","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2011,2]]}}}