{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T06:05:02Z","timestamp":1770271502017,"version":"3.49.0"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2012,10]]},"DOI":"10.1109\/jssc.2012.2204930","type":"journal-article","created":{"date-parts":[[2012,9,12]],"date-time":"2012-09-12T01:32:42Z","timestamp":1347413562000},"page":"2327-2334","source":"Crossref","is-referenced-by-count":11,"title":["Liquid\u2013Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines"],"prefix":"10.1109","volume":"47","author":[{"given":"Parrish","family":"Ralston","sequence":"first","affiliation":[]},{"given":"Marcus","family":"Oliver","sequence":"additional","affiliation":[]},{"given":"Krishna","family":"Vummidi","sequence":"additional","affiliation":[]},{"given":"Sanjay","family":"Raman","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2010.5515993"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/33.2973"},{"key":"ref12","author":"kraptchetov","year":"2008","journal-title":"Conjugated dithiols as model systems for molecular electronics Assembly structure and electrical response"},{"key":"ref13","first-page":"105","article-title":"Experimental investigations of electromagnetic instabilities of free surfaces in a liquid metal drop","author":"karcher","year":"2003","journal-title":"International Scientific Colloquium"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1002\/anie.200703642"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISAPM.2005.1432083"},{"key":"ref16","year":"0","journal-title":"SU-8 permanent photoresists"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2000.895502"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-79394-8"},{"key":"ref19","author":"studtmann","year":"2011"},{"key":"ref4","doi-asserted-by":"crossref","DOI":"10.1109\/9780471754503","author":"ulrich","year":"2006","journal-title":"Advanced Electronic Packaging"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MMW.2005.1511912"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2010.2078410"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2006.249528"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"469","DOI":"10.1049\/el.2009.0309","article-title":"Monolithic micro-coaxial power dividers","volume":"45","author":"saito","year":"2009","journal-title":"Electron Lett"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2009.5165734"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.1996.508504"},{"key":"ref1","first-page":"1823","article-title":"Rf and mechanical characterization of flip-chip interconnects in cpw circuits with underfill","volume":"3","author":"feng","year":"1998","journal-title":"IEEE MTT-S Int Microw Symp Dig"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2009.5165733"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4\/6320632\/06298947.pdf?arnumber=6298947","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,1,23]],"date-time":"2018-01-23T23:34:53Z","timestamp":1516750493000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6298947\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,10]]},"references-count":19,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2012.2204930","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,10]]}}}