{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,6]],"date-time":"2026-10-06T02:44:11Z","timestamp":1791254651829,"version":"4.1.0"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2012,11,1]],"date-time":"2012-11-01T00:00:00Z","timestamp":1351728000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2012,11]]},"DOI":"10.1109\/jssc.2012.2211698","type":"journal-article","created":{"date-parts":[[2012,9,12]],"date-time":"2012-09-12T21:17:12Z","timestamp":1347484632000},"page":"2576-2585","source":"Crossref","is-referenced-by-count":46,"title":["1-W 3.3\u201316.3-V Boosting Wireless Power Transfer Circuits With Vector Summing Power Controller"],"prefix":"10.1109","volume":"47","author":[{"given":"Kazutoshi","family":"Tomita","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ryota","family":"Shinoda","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tadahiro","family":"Kuroda","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroki","family":"Ishikuro","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2211698"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2131770"},{"key":"ref12","first-page":"522","article-title":"A 1.2-to-8 V charge-pump with improved power efficiency for non-volatille memories","author":"richelli","year":"2007","journal-title":"IEEE ISSCC Tech Dig"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2009.5316444"},{"key":"ref14","first-page":"4460","article-title":"Variable-phase contactless energy transfer desktop part I: Design","author":"sonntag","year":"2008","journal-title":"Int Conf Electr Mach Syst Dig"},{"key":"ref15","first-page":"45","article-title":"Piezoelectric-transformer inverter with full-bridge phase-shift control scheme","author":"ishii","year":"1999","journal-title":"Inst Electron Inf Commun Eng Dig"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-90-481-2412-1_2"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9781139166980"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2012326"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.835822"},{"key":"ref4","first-page":"230","article-title":"6 W\/25 <ref_formula><tex Notation=\"TeX\">${\\hbox {mm}}^{2}$<\/tex> <\/ref_formula> inductive power transfer for non-contact wafer-level testing","author":"radecki","year":"2011","journal-title":"IEEE ISSCC Tech Dig Papers"},{"key":"ref3","first-page":"492","article-title":"A 12 Gb\/s non-contact interface with coupled transmission lines","author":"takeya","year":"2011","journal-title":"IEEE ISSCC Dig"},{"key":"ref6","first-page":"2011","article-title":"Basic study of improving efficiency of wireless power transfer via magnetic resonance coupling based on impedance matching","author":"beh","year":"2010","journal-title":"IEEE Int Symp Ind Electron Tech Dig Papers"},{"key":"ref5","first-page":"115","article-title":"Non-contact 10% efficient 36 mW power delivery using on-chip inductor in 0.18 <ref_formula><tex Notation=\"TeX\">$\\mu{\\hbox {m}}$<\/tex><\/ref_formula> CMOS","author":"yuan","year":"2007","journal-title":"Proc IEEE ASSCC Dig Tech Papers"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/0470868023.ch5"},{"key":"ref7","first-page":"1","year":"2011","journal-title":"Qi System Description Wireless Power Transfer Volumw I Low Power Part 1 Interface Definition Version 1 0 2"},{"key":"ref2","first-page":"199","article-title":"Simultaneous 6 Gb\/s data and 10 mW power transmission using nested clover coils for non-contact memory card","author":"yuan","year":"2010","journal-title":"IEEE Symp VLSI Circuits Dig Tech Papers"},{"key":"ref1","year":"0"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2131810"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4\/6339059\/06301783.pdf?arnumber=6301783","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:51:27Z","timestamp":1633909887000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6301783\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,11]]},"references-count":19,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2012.2211698","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,11]]}}}