{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T02:21:00Z","timestamp":1706062860670},"reference-count":10,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2013,3,1]],"date-time":"2013-03-01T00:00:00Z","timestamp":1362096000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2013,3]]},"DOI":"10.1109\/jssc.2013.2242711","type":"journal-article","created":{"date-parts":[[2013,2,20]],"date-time":"2013-02-20T21:52:22Z","timestamp":1361397142000},"page":"790-800","source":"Crossref","is-referenced-by-count":13,"title":["A 12-Gb\/s Non-Contact Interface With Coupled Transmission Lines"],"prefix":"10.1109","volume":"48","author":[{"given":"Tsutomu","family":"Takeya","sequence":"first","affiliation":[]},{"given":"Lan","family":"Nan","sequence":"additional","affiliation":[]},{"given":"Shinya","family":"Nakano","sequence":"additional","affiliation":[]},{"given":"Noriyuki","family":"Miura","sequence":"additional","affiliation":[]},{"given":"Hiroki","family":"Ishikuro","sequence":"additional","affiliation":[]},{"given":"Tadahiro","family":"Kuroda","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"199","article-title":"Simultaneous 6 Gb\/s data and 10 mW power transmission using nested clover coils for non-contact memory cards","author":"yuan","year":"2011","journal-title":"IEEE Symp VLSI Circuits Dig"},{"key":"ref3","first-page":"264","article-title":"A 2.5 Gb\/s\/ch 4 PAM inductive-coupling transceiver for non-contact memory card","author":"kawai","year":"2010","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref10","author":"wadell","year":"1991","journal-title":"Transmission Line Design Handbook"},{"key":"ref6","first-page":"492","article-title":"A 12 Gb\/s non-contact interface with coupled transmission lines","author":"takeya","year":"2011","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/4.881207"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1982.1131337"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/HIS.2001.946695"},{"key":"ref2","first-page":"448","article-title":"Two 10 Gb\/s\/pin low-power interconnect methods for 3D ICs","author":"gu","year":"2007","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref9","first-page":"529","article-title":"Effect of shield insertion on reducing crosstalk noise between coupled interconnects","volume":"2","author":"zhang","year":"2004","journal-title":"Proc Int Symp Circuits and Systems (ISCAS)"},{"key":"ref1","first-page":"298","article-title":"An 11 Gb\/s inductive-coupling link with burst transmission","author":"miura","year":"2008","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/6466407\/06466437.pdf?arnumber=6466437","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:28:39Z","timestamp":1638217719000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6466437\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,3]]},"references-count":10,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2013.2242711","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,3]]}}}