{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,10]],"date-time":"2026-05-10T04:34:54Z","timestamp":1778387694709,"version":"3.51.4"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2014,2,1]],"date-time":"2014-02-01T00:00:00Z","timestamp":1391212800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/jssc.2013.2295979","type":"journal-article","created":{"date-parts":[[2014,1,31]],"date-time":"2014-01-31T17:42:16Z","timestamp":1391190136000},"page":"513-523","source":"Crossref","is-referenced-by-count":47,"title":["Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring"],"prefix":"10.1109","volume":"49","author":[{"given":"Yingzhe","family":"Hu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Warren S. A.","family":"Rieutort-Louis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Josue","family":"Sanz-Robinson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liechao","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Branko","family":"Glisic","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"James C.","family":"Sturm","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sigurd","family":"Wagner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naveen","family":"Verma","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref30","first-page":"292","article-title":"A 107 pJ\/b 100 kb\/s 0.18 <formula formulatype=\"inline\"><tex Notation=\"TeX\">$\\mu\\hbox{m}$<\/tex><\/formula> capacitive-coupling transceiver for printable communication sheet","author":"liu","year":"2008","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2005.861727"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2006.1696149"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICT.1997.667595"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/40.928763"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2012.6243858"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1063\/1.2213010"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1063\/1.2963481"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2008.2003330"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1038\/nature05533"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2170635"},{"key":"ref28","first-page":"290","article-title":"An inductively-coupled 64 b organic RFID tag operating at 13.56 MHz with a data rate of 787 b\/s","author":"myny","year":"2008","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref4","first-page":"3","article-title":"Long-gauge fibre-optic sensors: A new approach to dynamic system","author":"casciati","year":"2004","journal-title":"Proc 1st European Conf Structural Contr"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2007.893180"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1177\/0583102406061499"},{"key":"ref6","author":"wipf","year":"2007","journal-title":"Evaluation of Steel Bridges (Volume I) Monitoring the Structural Condition of Fracture-Critical Bridges Using Fiber Optic Technology"},{"key":"ref29","author":"sheldon","year":"2001","journal-title":"Encyclopiedia of Networking & Telecomminications"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1177\/058310249803000201"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.2335838"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1557\/mrs2008.141"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1117\/12.852340"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434013"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2012.6243763"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2191038"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1149\/1.1837903"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2043886"},{"key":"ref24","first-page":"46","article-title":"RFID chip assembly for 0.1 cents?","author":"pristauz","year":"2006","journal-title":"Onboard Technol"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2012.6243819"},{"key":"ref26","year":"0","journal-title":"Full-Bridge for Bending or Axial Tension Transducer Quality"},{"key":"ref25","author":"fjelstad","year":"2006","journal-title":"Flexible Circuit Technology"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/6722899\/06709767.pdf?arnumber=6709767","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:29:22Z","timestamp":1642004962000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6709767\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":30,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2013.2295979","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,2]]}}}