{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T16:34:15Z","timestamp":1772642055533,"version":"3.50.1"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2015,10,1]],"date-time":"2015-10-01T00:00:00Z","timestamp":1443657600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"KFSP Molecular Imaging and the KFSP Tumor Oxygenation of the University of Zurich"},{"name":"National Competence Center for Biomedical Imaging"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2015,10]]},"DOI":"10.1109\/jssc.2015.2467170","type":"journal-article","created":{"date-parts":[[2015,9,10]],"date-time":"2015-09-10T18:41:36Z","timestamp":1441910496000},"page":"2406-2418","source":"Crossref","is-referenced-by-count":97,"title":["A 1 \u00d7 400 Backside-Illuminated SPAD Sensor With 49.7 ps Resolution, 30 pJ\/Sample TDCs Fabricated in 3D CMOS Technology for Near-Infrared Optical Tomography"],"prefix":"10.1109","volume":"50","author":[{"given":"Juan Mata","family":"Pavia","sequence":"first","affiliation":[]},{"given":"Mario","family":"Scandini","sequence":"additional","affiliation":[]},{"given":"Scott","family":"Lindner","sequence":"additional","affiliation":[]},{"given":"Martin","family":"Wolf","sequence":"additional","affiliation":[]},{"given":"Edoardo","family":"Charbon","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1364\/AO.42.005785"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1364\/JOSAA.11.002727"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2014.2313983"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2188466"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2014.2341562"},{"key":"ref13","first-page":"77","article-title":"A 32$\\,\\times \\,$32 50 ps resolution 10 bit time to digital converter array in 130 nm CMOS for time correlated imaging","author":"richardson","year":"2009","journal-title":"Proc IEEE Custom Integr Circuits Conf (CICC)"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2284351"},{"key":"ref15","article-title":"A 67,392 SPAD PVTB-compensated multi-channel digital SiPM with 432 column-parallel 48 ps 17-bit TDCs for endoscopic time-of-flight PET","author":"carimatto","year":"2015","journal-title":"IEEE Int Solid-State Circuits Conf Dig Techn Papers (ISSCC)"},{"key":"ref16","first-page":"312","article-title":"A 160$\\,\\times\\,$128 single-photon image sensor with on-pixel 55 ps 10 b time-to-digital converter","author":"veerappan","year":"2011","journal-title":"IEEE Int Solid-State Circuits Conf Dig Techn Papers"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1364\/OE.20.005849"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2012.2187420"},{"key":"ref19","first-page":"238","article-title":"A silicon photomultiplier with $ > $ 30% detection efficiency from 450–750 nm and 11.6 $\\mu {\\hbox {m}}$ pitch NMOS-only pixel with 21.6% fill factor in 130 nm CMOS","author":"webster","year":"2012","journal-title":"Proc Euro Solid-State Device Res Conf (ESSDERC)"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2003.1257138"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1364\/OE.16.005048"},{"key":"ref27","first-page":"556","article-title":"A CMOS 64$\\,\\times\\,$48 single photon avalanche diode array with event-driven readout","author":"niclass","year":"2006","journal-title":"Proc 32nd Eur Solid-State Circuits Conf (ESSCIRC)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1088\/0266-5611\/25\/12\/123010"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/cnm.1162"},{"key":"ref29","article-title":"A dual backside-illuminated 800-cell multi-channel digital SiPM with 100 TDCs in 130 nm 3D IC technology","author":"charbon","year":"2014","journal-title":"IEEE Nucl Sci Symp Med Imag Conf (NSS\/MIC)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/OE.17.014780"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1117\/1.3088140"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1364\/AO.48.00D137"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.neuroimage.2013.05.004"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1364\/AO.42.003170"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/0266-5611\/15\/2\/022"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2293777"},{"key":"ref22","article-title":"3D-IC integration","author":"torki","year":"2013","journal-title":"Proc CMP Annu Users Meeting"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2284352"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2006445"},{"key":"ref23","first-page":"1","article-title":"The NCSU Tezzaron design kit","author":"lipa","year":"2010","journal-title":"Proc IEEE Int 3D Syst Integr Conf (3DIC)"},{"key":"ref26","author":"niclass","year":"2008","journal-title":"Single-photon image sensors in CMOS picosecond resolution for three-dimensional imaging"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2007.902088"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/7279217\/07254251.pdf?arnumber=7254251","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:03:35Z","timestamp":1642003415000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7254251\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,10]]},"references-count":31,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2015.2467170","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015,10]]}}}