{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,6,11]],"date-time":"2024-06-11T13:57:05Z","timestamp":1718114225949},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2016,4,1]],"date-time":"2016-04-01T00:00:00Z","timestamp":1459468800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"CRESTJST"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2016,4]]},"DOI":"10.1109\/jssc.2015.2512959","type":"journal-article","created":{"date-parts":[[2016,1,19]],"date-time":"2016-01-19T20:51:33Z","timestamp":1453236693000},"page":"1041-1050","source":"Crossref","is-referenced-by-count":8,"title":["An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories"],"prefix":"10.1109","volume":"51","member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2211698"},{"key":"ref11","first-page":"138","article-title":"1\ufffdGB\/s 2Tb NAND flash multi-chip package with frequency-boosting interface chip","author":"kim","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref12","first-page":"64","article-title":"A 7Gb\/s rapid on\/off embedded-clock serial-link transceiver with 20\ufffdns power-on time, 740 W off-state power for energy-proportional links in 65\ufffdnm CMOS","author":"anand","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref13","first-page":"202","article-title":"1.2Gb\/s 3.9pJ\/b mono-phase pulse-modulation inductive-coupling transceiver for mm-range board-to-board communication","author":"cho","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref14","first-page":"93","article-title":"500\ufffdMbps, 670 W\/pin capacitively coupled receiver with self reset scheme for wireless connectors","author":"ikeuchi","year":"0","journal-title":"Proc IEEE Asian Solid-State Circuits Conf"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2437515"},{"key":"ref16","author":"bogatin","year":"2013","journal-title":"Signal and Power Integrity–Simplified"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746283"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177074"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2298282"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/HOLM.2008.ECP.20"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1093\/ietele\/e88-c.8.1532"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2242711"},{"key":"ref5","first-page":"59","article-title":"Project Ara Module Developers Kit Release 0.21","year":"2015"},{"key":"ref8","first-page":"176","article-title":"A 6Gb\/s 6pJ\/b 5\ufffdmm-distance non-contact interface for modular smartphones using two-fold transmission line coupler and EMC-qualified pulse transceiver","author":"kosuge","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2282113"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EMCSI.2015.7107683"},{"key":"ref1","article-title":"The second wave of the SSD revolution","author":"yasarapu","year":"0","journal-title":"Flash Memory Summit"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2015.7231350"},{"key":"ref20","article-title":"Application Note: What Types of ECC Should Be Used on Flash Memory?","year":"2011"},{"key":"ref21","article-title":"Spansion® SLC NAND Flash Memory for Embedded, S34MS01G2, S34MS02G2, S34MS04G2 Data Sheet","year":"2015"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/7446371\/7386603.pdf?arnumber=7386603","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:45:09Z","timestamp":1642005909000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7386603\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,4]]},"references-count":21,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2015.2512959","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,4]]}}}