{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,30]],"date-time":"2026-03-30T15:19:26Z","timestamp":1774883966815,"version":"3.50.1"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Minister of Science and Technology (MOST) of China","doi-asserted-by":"publisher","award":["2018YFB2202900"],"award-info":[{"award-number":["2018YFB2202900"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004663","name":"Minister of Science and Technology (MOST) of China","doi-asserted-by":"publisher","award":["2016YFA0203800"],"award-info":[{"award-number":["2016YFA0203800"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61704029"],"award-info":[{"award-number":["61704029"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61525401"],"award-info":[{"award-number":["61525401"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61834009"],"award-info":[{"award-number":["61834009"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61874028"],"award-info":[{"award-number":["61874028"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61821091"],"award-info":[{"award-number":["61821091"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Major Science and Technology Special Project of China","award":["2017ZX02301007-001"],"award-info":[{"award-number":["2017ZX02301007-001"]}]},{"DOI":"10.13039\/501100002367","name":"Strategic Priority Research Program of the Chinese Academy of Sciences","doi-asserted-by":"publisher","award":["XDB44000000"],"award-info":[{"award-number":["XDB44000000"]}],"id":[{"id":"10.13039\/501100002367","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2021,3]]},"DOI":"10.1109\/jssc.2020.3025756","type":"journal-article","created":{"date-parts":[[2020,10,1]],"date-time":"2020-10-01T20:20:21Z","timestamp":1601583621000},"page":"988-1000","source":"Crossref","is-referenced-by-count":17,"title":["High-Density 3-D Stackable Crossbar 2D2R nvTCAM With Low-Power Intelligent Search for Fast Packet Forwarding in 5G Applications"],"prefix":"10.1109","volume":"56","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3078-4542","authenticated-orcid":false,"given":"Keji","family":"Zhou","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9001-4569","authenticated-orcid":false,"given":"Xiaoyong","family":"Xue","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3387-1238","authenticated-orcid":false,"given":"Jianguo","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Xiaoxin","family":"Xu","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4727-9224","authenticated-orcid":false,"given":"Hangbing","family":"Lv","sequence":"additional","affiliation":[]},{"given":"Minge","family":"Jing","sequence":"additional","affiliation":[]},{"given":"Jing","family":"Li","sequence":"additional","affiliation":[]},{"given":"Xiaoyang","family":"Zeng","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0937-7547","authenticated-orcid":false,"given":"Ming","family":"Liu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"104","article-title":"1Mb 0.41 m2 2T-2R cell nonvolatile TCAM with two-bit encoding and clocked self-referenced sensing","volume":"2013","author":"li","year":"0","journal-title":"Proc Symp VLSI Circuits (VLSIC)"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.916624"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2005.95"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IGBSG.2016.7539441"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2004.1359039"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2280296"},{"key":"ref16","year":"0","journal-title":"Bgp Table Statistics"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242466"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2015.2427393"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/INFCOM.2003.1208657"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063054"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/4.726560"},{"key":"ref6","first-page":"44","article-title":"A 3.14 $\\mu{\\mathrm{ m}}$\n2 4T-2MTJ-cell fully parallel TCAM based on nonvolatile logic-in-memory architecture","author":"matsunaga","year":"2012","journal-title":"Proc Symp VLSI Circuits (VLSIC)"},{"key":"ref5","first-page":"136","article-title":"A 256b-wordlength ReRAM-based TCAM with 1ns search-time and 14X improvement in word length-energy efficiency-density product using 2.5T1R cell","volume":"2016","author":"lin","year":"0","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref8","first-page":"99","article-title":"ReRAM-based 4T2R nonvolatile TCAM with 7x NVM-stress reduction, and 4x improvement in speed-wordlength-capacity for normally-off instant-on filter-based search engines used in big-data processing","author":"huang","year":"2014","journal-title":"Proc Symp VLSI Circuits Dig Tech Papers"},{"key":"ref7","first-page":"298","article-title":"Fully parallel 6T-2MTJ nonvolatile TCAM with single-transistor-based self match-line discharge control","author":"matsunaga","year":"2011","journal-title":"Proc Symp VLSI Circuits (VLSIC)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.837979"},{"key":"ref9","first-page":"106","article-title":"Fabrication of a 99%-energy-less nonvolatile multi-functional CAM chip using hierarchical power gating for a massively-parallel full-text-search engine","volume":"2013","author":"matsunaga","year":"0","journal-title":"Proc Symp VLSI Circuits (VLSIC)"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.864128"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.comnet.2019.106898"},{"key":"ref22","first-page":"44","article-title":"High performance unipolar AlOy\/HfOx\/Ni based RRAM compatible with Si diodes for 3D application","author":"tran","year":"2011","journal-title":"Proc Symp VLSI Technol"},{"key":"ref21","year":"2020","journal-title":"International Roadmap for Devices and Systems"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2015.2468993"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046999"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2889106"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/9361453\/09210781.pdf?arnumber=9210781","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T14:54:56Z","timestamp":1652194496000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9210781\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,3]]},"references-count":25,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2020.3025756","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,3]]}}}