{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:03:22Z","timestamp":1740132202610,"version":"3.37.3"},"reference-count":1,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,1]],"date-time":"2022-02-01T00:00:00Z","timestamp":1643673600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003399","name":"Science and Technology Commission of Shanghai Municipality","doi-asserted-by":"publisher","award":["2018SHZDZX01"],"award-info":[{"award-number":["2018SHZDZX01"]}],"id":[{"id":"10.13039\/501100003399","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2022,2]]},"DOI":"10.1109\/jssc.2021.3114450","type":"journal-article","created":{"date-parts":[[2022,1,27]],"date-time":"2022-01-27T22:33:01Z","timestamp":1643322781000},"page":"671-671","source":"Crossref","is-referenced-by-count":0,"title":["Erratum to \u201cA Nonlinear Receiver Leveraging Cascaded Inverter-Based Envelope-Biased LNAs for In-Band Interference Suppression in the Amplitude Domain\u201d [Nov 21 3360-3374]"],"prefix":"10.1109","volume":"57","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1963-149X","authenticated-orcid":false,"given":"Dawei","family":"Ye","sequence":"first","affiliation":[{"name":"State Key Laboratory of ASIC and System, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0632-2775","authenticated-orcid":false,"given":"Rongjin","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and System, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3157-3464","authenticated-orcid":false,"given":"C.-J. Richard","family":"Shi","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Washington, Seattle, WA, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3109935"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/9694622\/09695166.pdf?arnumber=9695166","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,13]],"date-time":"2024-01-13T22:13:32Z","timestamp":1705184012000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9695166\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2]]},"references-count":1,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2021.3114450","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2022,2]]}}}