{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T16:48:26Z","timestamp":1783702106928,"version":"3.55.0"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung Electronics Company Ltd., South Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea through the Korea Government","doi-asserted-by":"publisher","award":["MSIT 2020M3F3A2A01081899"],"award-info":[{"award-number":["MSIT 2020M3F3A2A01081899"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea through the Korea Government","doi-asserted-by":"publisher","award":["NRF-2020R1C1C1004470"],"award-info":[{"award-number":["NRF-2020R1C1C1004470"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2022,12]]},"DOI":"10.1109\/jssc.2022.3193712","type":"journal-article","created":{"date-parts":[[2022,8,2]],"date-time":"2022-08-02T21:56:21Z","timestamp":1659477381000},"page":"3840-3852","source":"Crossref","is-referenced-by-count":31,"title":["A Fully Integrated Multi-Phase Buck Converter With On-Chip Capacitor Dynamic Re-Allocation and Fine-Grained Phase-Shedding Techniques"],"prefix":"10.1109","volume":"57","author":[{"given":"Jeong-Hyun","family":"Cho","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4186-0424","authenticated-orcid":false,"given":"Dong-Kyu","family":"Kim","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, KAIST, Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7062-5490","authenticated-orcid":false,"given":"Hong-Hyun","family":"Bae","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9257-0681","authenticated-orcid":false,"given":"Yong-Jin","family":"Lee","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8331-1223","authenticated-orcid":false,"given":"Seok-Tae","family":"Koh","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, KAIST, Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Younghwan","family":"Choo","sequence":"additional","affiliation":[{"name":"Samsung Electronics Company Ltd., Hwaseong, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8055-7970","authenticated-orcid":false,"given":"Ji-Seon","family":"Paek","sequence":"additional","affiliation":[{"name":"Samsung Electronics Company Ltd., Hwaseong, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4564-7938","authenticated-orcid":false,"given":"Hyun-Sik","family":"Kim","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/CICC51472.2021.9431437"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2014.2378284"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.889381"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2840513"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.917321"},{"key":"ref12","first-page":"306","article-title":"A 12A $\\text{I}_{max}$\n, fully integrated multi-phase voltage regulator with 91.5% peak efficiency at 1.8 to 1 V, operating at 50 MHz and featuring a digitally assisted controller with automatic phase shedding and soft switching in 4 nm class FinFET CMOS","author":"schaef","year":"2022","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3023884"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351155"},{"key":"ref15","first-page":"1","article-title":"A 0.4 V~1V 0.2A\/mm2 70% efficient 500 MHz fully integrated digitally controlled 3-level buck voltage regulator with on-die high density MIM capacitor in 22 nm tri-gate CMOS","author":"kumar","year":"2015","journal-title":"Proc IEEE Custom Integrated Circuits Conf (CICC)"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2014.6858438"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2946218"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00071"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3084218"},{"key":"ref28","first-page":"298","article-title":"A 1.23 W\/mm2 83.7%-efficiency 400 MHz 6-phase fully integrated buck converter in 28 nm CMOS with on-chip capacitor dynamic re-allocation for inter-inductor current balancing and fast DVS of 75 mV\/ns","author":"cho","year":"2022","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref4","first-page":"262","article-title":"Peak-current-controlled ganged integrated high-frequency buck voltage regulators in 22 nm CMOS for robust cross-tile current sharing","author":"desai","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2233220"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2286545"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3036394"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2018.2844615"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3112129"},{"key":"ref8","first-page":"727","article-title":"A 100 MHz eight-phase buck converter delivering 12A in 25 mm2 using air-core inductors","author":"schrom","year":"2007","journal-title":"Proc 22nd Annu IEEE Appl Power Electron Conf Expo (APEC)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.842837"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2169309"},{"key":"ref9","first-page":"86","article-title":"4.5 A 2-phase resonant switched-capacitor converter delivering 4.3 W at 0.6 W\/mm2 with 85% efficiency","author":"kesarwani","year":"2014","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref1","first-page":"432","article-title":"FIVR—Fully integrated voltage regulators on 4th generation Intel Core SoCs","author":"burton","year":"2014","journal-title":"Proc IEEE Appl Power Electron Conf Expo (APEC)"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2017.7931042"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2360400"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2768412"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2018.8579301"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2742944"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2011.5744735"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2151820"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/9962295\/09847278.pdf?arnumber=9847278","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,12]],"date-time":"2022-12-12T19:41:12Z","timestamp":1670874072000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9847278\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12]]},"references-count":32,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2022.3193712","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,12]]}}}