{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,30]],"date-time":"2026-10-30T04:10:37Z","timestamp":1793333437762,"version":"4.5.0"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2023,4]]},"DOI":"10.1109\/jssc.2022.3197415","type":"journal-article","created":{"date-parts":[[2022,8,25]],"date-time":"2022-08-25T14:37:24Z","timestamp":1661438244000},"page":"1160-1171","source":"Crossref","is-referenced-by-count":28,"title":["A Wireless Hysteretic Controlled Wireless Power Transfer System With Enhanced Efficiency and Dynamic Response for Bioimplants"],"prefix":"10.1109","volume":"58","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8162-906X","authenticated-orcid":false,"given":"Junyao","family":"Tang","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2873-6274","authenticated-orcid":false,"given":"Lei","family":"Zhao","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4371-7370","authenticated-orcid":false,"given":"Cheng","family":"Huang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2055371"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.884862"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2384736"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2387832"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2657603"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2287592"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2015.7063010"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2015.7063009"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2767181"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177018"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062923"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2366814"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2003.822038"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365859"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2582871"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2517119"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2894359"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2928815"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2013.2270177"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2013.6487639"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2103172"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10082904\/09861386.pdf?arnumber=9861386","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T07:12:32Z","timestamp":1706771552000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9861386\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4]]},"references-count":21,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2022.3197415","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,4]]}}}