{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:03:40Z","timestamp":1740132220394,"version":"3.37.3"},"reference-count":0,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2022,12]]},"DOI":"10.1109\/jssc.2022.3212205","type":"journal-article","created":{"date-parts":[[2022,11,24]],"date-time":"2022-11-24T19:29:39Z","timestamp":1669318179000},"page":"3509-3513","source":"Crossref","is-referenced-by-count":0,"title":["Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)"],"prefix":"10.1109","volume":"57","author":[{"given":"Wanghua","family":"Wu","sequence":"first","affiliation":[{"name":"Samsung Semiconductor, San Jose, CA, USA"}]},{"given":"Hiroyuki","family":"Ito","sequence":"additional","affiliation":[{"name":"Institute of Innovative Research Tokyo Institute of Technology, Yokohama, Japan"}]},{"given":"Jens","family":"Anders","sequence":"additional","affiliation":[{"name":"Institute of Smart Sensors and IMS CHIPS University of Stuttgart, Stuttgart, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9186-7544","authenticated-orcid":false,"given":"Ahmed M. A.","family":"Ali","sequence":"additional","affiliation":[{"name":"Apple, Cupertino, CA, USA"}]},{"given":"Gael","family":"Pillonnet","sequence":"additional","affiliation":[{"name":"CEA-Leti, Univ. Grenoble Alpes, Grenoble, France"}]}],"member":"263","container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/9962295\/09962304.pdf?arnumber=9962304","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,9]],"date-time":"2022-12-09T18:43:09Z","timestamp":1670611389000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9962304\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12]]},"references-count":0,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2022.3212205","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"type":"print","value":"0018-9200"},{"type":"electronic","value":"1558-173X"}],"subject":[],"published":{"date-parts":[[2022,12]]}}}