{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,30]],"date-time":"2026-01-30T05:39:44Z","timestamp":1769751584881,"version":"3.49.0"},"reference-count":49,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,1]],"date-time":"2023-10-01T00:00:00Z","timestamp":1696118400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Information Technology Research Center (ITRC) Program through the Institute of Information and Communications Technology Planning and Evaluation (IITP), Korea"},{"DOI":"10.13039\/501100014188","name":"Ministry of Science and ICT (MSIT), Korea","doi-asserted-by":"publisher","award":["IITP-2020-0-01778"],"award-info":[{"award-number":["IITP-2020-0-01778"]}],"id":[{"id":"10.13039\/501100014188","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Technology Innovation Program"},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20014214"],"award-info":[{"award-number":["20014214"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003836","name":"IC Design Education Center (IDEC), South Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003836","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2023,10]]},"DOI":"10.1109\/jssc.2023.3276130","type":"journal-article","created":{"date-parts":[[2023,5,25]],"date-time":"2023-05-25T17:53:32Z","timestamp":1685037212000},"page":"2778-2789","source":"Crossref","is-referenced-by-count":7,"title":["A Wide-Bandwidth Ultrasound Receiver and On-Chip Ultrasound Transmitter for Ultrasound Capsule Endoscopy"],"prefix":"10.1109","volume":"58","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0568-0845","authenticated-orcid":false,"given":"Kyeongwon","family":"Jeong","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8501-6575","authenticated-orcid":false,"given":"Gichan","family":"Yun","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3062-846X","authenticated-orcid":false,"given":"Jaesuk","family":"Choi","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8645-4537","authenticated-orcid":false,"given":"Injun","family":"Choi","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}]},{"given":"Jeehoon","family":"Son","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4659-6009","authenticated-orcid":false,"given":"Jae Youn","family":"Hwang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3589-086X","authenticated-orcid":false,"given":"Sohmyung","family":"Ha","sequence":"additional","affiliation":[{"name":"Division of Engineering, New York University Abu Dhabi, Abu Dhabi, United Arab Emirates"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4580-2771","authenticated-orcid":false,"given":"Minkyu","family":"Je","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/S0929-6441(09)60012-6"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2274895"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2505714"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310247"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2019.8925827"},{"issue":"1","key":"ref6","first-page":"20","article-title":"Endoscopic ultrasound staging of esophageal cancer","volume":"16","author":"Thakkar","year":"2020","journal-title":"Gastroenterol. Hepatol."},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3748\/wjg.14.1479"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1111\/j.1442-2050.2010.01086.x"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1093\/bjaceaccp\/mkr030"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s00464-005-0144-3"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.4253\/wjge.v4.i6.218"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1136\/gut.2003.029421"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/S0016-5107(96)70225-0"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2014.0168"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2014.0181"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.21037\/atm.2017.04.21"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TMI.2017.2699973"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC56115.2022.9980696"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2012.2219532"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2014.6722610"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2015.0521"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2828826"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310246"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662531"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365808"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2016.7728580"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2009.1230"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/EMBC.2019.8857671"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2007.463"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2018.2836915"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2749425"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2599580"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870463"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063058"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830401"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2871081"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3019487"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3193944"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662299"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2019.8777942"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2018.07.033"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.872704"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.3390\/electronics8050480"},{"issue":"5","key":"ref44","article-title":"The Hardware concept of a new digital ultrasonic NDE system","volume":"3","author":"Uodziunas","year":"1998","journal-title":"J. Nondestruct. Test."},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3040548"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2014.0641"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2009.2023912"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2014.6942108"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/58.656639"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10262388\/10136186.pdf?arnumber=10136186","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,11]],"date-time":"2024-01-11T23:46:33Z","timestamp":1705016793000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10136186\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10]]},"references-count":49,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3276130","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,10]]}}}