{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T13:20:25Z","timestamp":1773840025447,"version":"3.50.1"},"reference-count":61,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100009105","name":"Ministry of Internal Affairs and Communications (MIC)\/Strategic Information and Communications Research and Development Promotion Program","doi-asserted-by":"publisher","award":["192203002"],"award-info":[{"award-number":["192203002"]}],"id":[{"id":"10.13039\/501100009105","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100009105","name":"Ministry of Internal Affairs and Communications (MIC)\/Strategic Information and Communications Research and Development Promotion Program","doi-asserted-by":"publisher","award":["192103003"],"award-info":[{"award-number":["192103003"]}],"id":[{"id":"10.13039\/501100009105","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100009105","name":"MIC","doi-asserted-by":"publisher","award":["JPJ000254"],"award-info":[{"award-number":["JPJ000254"]}],"id":[{"id":"10.13039\/501100009105","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Tokyo Tech Advanced Researchers"},{"DOI":"10.13039\/100006422","name":"VLSI Design and Education Center (VDEC) in collaboration with Cadence Design Systems Inc., Mentor Graphics Inc., and Keysight Technologies Japan Ltd","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006422","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1109\/jssc.2023.3308562","type":"journal-article","created":{"date-parts":[[2023,9,14]],"date-time":"2023-09-14T17:53:15Z","timestamp":1694713995000},"page":"349-363","source":"Crossref","is-referenced-by-count":18,"title":["A Low-Power Radiation-Hardened <i>Ka<\/i>-Band CMOS Phased-Array Receiver for Small Satellite Constellation"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7201-7763","authenticated-orcid":false,"given":"Xi","family":"Fu","sequence":"first","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"given":"Dongwon","family":"You","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7773-1619","authenticated-orcid":false,"given":"Yun","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"given":"Xiaolin","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5529-8217","authenticated-orcid":false,"given":"Ashibir Aviat","family":"Fadila","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5645-3688","authenticated-orcid":false,"given":"Chenxin","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"given":"Sena","family":"Kato","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"given":"Chun","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7564-9838","authenticated-orcid":false,"given":"Zheng","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6278-6294","authenticated-orcid":false,"given":"Jian","family":"Pang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"given":"Atsushi","family":"Shirane","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1082-7672","authenticated-orcid":false,"given":"Kenichi","family":"Okada","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/rfic51843.2021.9490463"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9366013"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063006"},{"key":"ref4","volume-title":"SATCOM Gen-1 K-Band Silicon RX Quad Core IC","year":"2021"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3045258"},{"key":"ref6","volume-title":"Ka-Band Silicon Intelligent Gain Block","year":"2021"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2817606"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830274"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310188"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.001.2001081"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2899734"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/rfic.2019.8701856"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2022.3176679"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731664"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062920"},{"key":"ref16","first-page":"226","article-title":"A 1 V W-band bidirectional transceiver front-end with < 1 dB T\/R switch loss, < 1\u00b0\/dB Phase\/Gain resolution and 12.3% TX PAE at 15.1 dBm output power in 65 nm CMOS technology","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Zhu"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063129"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8059022"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2774804"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IMS30576.2020.9223977"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067629"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067451"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC49505.2020.9218421"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LMWT.2023.3264810"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3097075"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3291814"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3096190"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/IMS37962.2022.9865668"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC54546.2022.9863148"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662324"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/rfic.2017.7969019"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2980509"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063120"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2019.8701767"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731557"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2014.6865498"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365861"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2014.6865498"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2020.2967744"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2362743"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3111134"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2544755"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1049\/ell2.12089"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/icsict.2010.5667770"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/IPFA.2018.8452610"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2019.8701733"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/radecs50773.2020.9857699"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1587\/transele.2020CDP0004"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/IMS30576.2020.9223854"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2528219"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2995307"},{"key":"ref52","first-page":"1115","article-title":"A 60 GHz CMOS power amplifier using capacitive cross-coupling neutralization with 16% PAE","volume-title":"Proc. 41st Eur. Microw. Conf.","author":"Asada"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2008.4561511"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2008.2001040"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2005.860671"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2018.8428987"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2469158"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1587\/transele.2021CTP0002"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2007.903451"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062894"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2015.2505624"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10416291\/10251164.pdf?arnumber=10251164","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T13:24:56Z","timestamp":1706793896000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10251164\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2]]},"references-count":61,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3308562","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2]]}}}