{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T05:34:09Z","timestamp":1782970449473,"version":"3.54.5"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000028","name":"Semiconductor Research Corporation","doi-asserted-by":"publisher","award":["Task 2810.034"],"award-info":[{"award-number":["Task 2810.034"]}],"id":[{"id":"10.13039\/100000028","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["1919147"],"award-info":[{"award-number":["1919147"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/jssc.2023.3313519","type":"journal-article","created":{"date-parts":[[2023,9,28]],"date-time":"2023-09-28T17:47:50Z","timestamp":1695923270000},"page":"960-971","source":"Crossref","is-referenced-by-count":38,"title":["DIMCA: An Area-Efficient Digital In-Memory Computing Macro Featuring Approximate Arithmetic Hardware in 28 nm"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7345-1916","authenticated-orcid":false,"given":"Chuan-Tung","family":"Lin","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-5970-8144","authenticated-orcid":false,"given":"Dewei","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3603-6016","authenticated-orcid":false,"given":"Bo","family":"Zhang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4813-3844","authenticated-orcid":false,"given":"Gregory K.","family":"Chen","sequence":"additional","affiliation":[{"name":"Circuit Research Laboratory, Intel Corporation, Hillsboro, OR, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6794-8806","authenticated-orcid":false,"given":"Phil C.","family":"Knag","sequence":"additional","affiliation":[{"name":"Circuit Research Laboratory, Intel Corporation, Hillsboro, OR, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2428-7099","authenticated-orcid":false,"given":"Ram Kumar","family":"Krishnamurthy","sequence":"additional","affiliation":[{"name":"Circuit Research Laboratory, Intel Corporation, Hillsboro, OR, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9722-0979","authenticated-orcid":false,"given":"Mingoo","family":"Seok","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","first-page":"1877","article-title":"Language models are few-shot learners","volume-title":"Proc. Adv. Neural Inf. Process. Syst.","volume":"33","author":"Brown"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR42600.2020.01079"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58452-8_13"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV48922.2021.00060"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV48922.2021.00986"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063111"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365928"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365791"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731757"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2963616"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2992886"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2880918"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2019.2922889"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3119018"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1038\/s41565-020-0655-z"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3029586"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3108344"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2022.3182935"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/CICC53496.2022.9772781"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952773"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2899730"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939682"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3061508"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830438"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731762"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731545"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067305"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067720"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2015.7401667"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2217962"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/2742060.2743760"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2867275"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/3.748832"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731659"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/4\/10445390\/10266328-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10445390\/10266328.pdf?arnumber=10266328","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T20:28:25Z","timestamp":1736540905000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10266328\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":37,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3313519","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}