{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,9]],"date-time":"2026-07-09T15:21:52Z","timestamp":1783610512282,"version":"3.55.0"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,6,1]],"date-time":"2024-06-01T00:00:00Z","timestamp":1717200000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000185","name":"Samsung Electronics and CoCoSys, one of seven centers in JUMP 2.0, an Semiconductor Research Corporation (SRC) program sponsored by Defense Advanced Research Projects Agency","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,6]]},"DOI":"10.1109\/jssc.2023.3332017","type":"journal-article","created":{"date-parts":[[2023,11,20]],"date-time":"2023-11-20T19:21:48Z","timestamp":1700508108000},"page":"1938-1949","source":"Crossref","is-referenced-by-count":40,"title":["MACC-SRAM: A Multistep Accumulation Capacitor-Coupling In-Memory Computing SRAM Macro for Deep Convolutional Neural Networks"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3603-6016","authenticated-orcid":false,"given":"Bo","family":"Zhang","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jyotishman","family":"Saikia","sequence":"additional","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7703-5020","authenticated-orcid":false,"given":"Jian","family":"Meng","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Cornell Tech, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dewei","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6688-0886","authenticated-orcid":false,"given":"Soonwan","family":"Kwon","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology, Samsung Electronics, Suwon-si, Gyeonggi-do, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2899-5092","authenticated-orcid":false,"given":"Sungmeen","family":"Myung","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology, Samsung Electronics, Suwon-si, Gyeonggi-do, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hyunsoo","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology, Samsung Electronics, Suwon-si, Gyeonggi-do, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2286-3790","authenticated-orcid":false,"given":"Sang Joon","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Advanced Institute of Technology, Samsung Electronics, Suwon-si, Gyeonggi-do, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4551-7789","authenticated-orcid":false,"given":"Jae-Sun","family":"Seo","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Cornell Tech, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9722-0979","authenticated-orcid":false,"given":"Mingoo","family":"Seok","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Columbia University, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Very deep convolutional networks for large-scale image recognition","author":"Simonyan","year":"2014","journal-title":"arXiv:1409.1556"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr.2015.7298594"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr.2016.308"},{"key":"ref4","first-page":"1097","article-title":"ImageNet classification with deep convolutional neural networks","volume":"25","author":"Krizhevsky","year":"2012","journal-title":"Neural Inf. Process. Syst."},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr.2016.90"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/jstsp.2020.2975903"},{"key":"ref7","article-title":"Deep compression: Compressing deep neural networks with pruning, trained quantization and Huffman coding","author":"Han","year":"2015","journal-title":"arXiv:1510.00149"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3200515"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731725"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063078"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731659"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/cicc53496.2022.9772781"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2963616"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310397"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310398"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2018.8502421"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.23919\/vlsic.2019.8778028"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662392"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062985"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062958"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/cicc48029.2020.9075883"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062995"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2020.2987714"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2020.2992886"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365958"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365989"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/cicc51472.2021.9431575"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.23919\/vlsicircuits52068.2021.9492444"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3211290"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3119018"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/cicc53496.2022.9772821"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/vlsi-dat.2019.8742044"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830153"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365984"},{"issue":"4","key":"ref36","first-page":"6623","article-title":"Harmonious coexistence of structured weight pruning and ternarization for deep neural networks","volume-title":"Proc. AAAI Conf. Artif. Intell.","volume":"34","author":"Yang"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731681"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10540332\/10322874.pdf?arnumber=10322874","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,29]],"date-time":"2024-05-29T04:38:22Z","timestamp":1716957502000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10322874\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6]]},"references-count":37,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3332017","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,6]]}}}