{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,14]],"date-time":"2026-07-14T14:59:57Z","timestamp":1784041197181,"version":"3.55.0"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62004041"],"award-info":[{"award-number":["62004041"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61934002"],"award-info":[{"award-number":["61934002"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,7]]},"DOI":"10.1109\/jssc.2023.3341865","type":"journal-article","created":{"date-parts":[[2023,12,19]],"date-time":"2023-12-19T19:31:26Z","timestamp":1703014286000},"page":"2248-2259","source":"Crossref","is-referenced-by-count":22,"title":["Piezoelectric Energy Harvesting Interface Using Self-Bias-Flip Rectifier and Switched-PEH DC\u2013DC for MPPT"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0009-0007-0739-7572","authenticated-orcid":false,"given":"Zhen","family":"Li","sequence":"first","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jing","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2799-1129","authenticated-orcid":false,"given":"Man-Kay","family":"Law","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Analog and Mixed Signal VLSI, IME, and FST-ECE, University of Macau, Macau, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6238-4423","authenticated-orcid":false,"given":"Sijun","family":"Du","sequence":"additional","affiliation":[{"name":"Department of Microelectronics, Delft University of Technology, Delft, CD, The Netherlands"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2685-5587","authenticated-orcid":false,"given":"Junrui","family":"Liang","sequence":"additional","affiliation":[{"name":"School of Information Science and Technology and the Shanghai Engineering Research Center of Energy Efficient and Custom AI IC, ShanghaiTech University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0314-0178","authenticated-orcid":false,"given":"Xu","family":"Cheng","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5245-0754","authenticated-orcid":false,"given":"Jun","family":"Han","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3986-137X","authenticated-orcid":false,"given":"Xiaoyang","family":"Zeng","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1198-9251","authenticated-orcid":false,"given":"Zhiyuan","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Integrated Chips and Systems and the School of Microelectronics, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2002.802194"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034442"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2200530"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2917158"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3153590"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2899973"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2924095"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3128625"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2016.2553152"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2022.3185392"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3127216"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3099011"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3041175"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TUFFC.2005.1428041"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2924963"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2615008"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2725959"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2750329"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2989873"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2893525"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3022424"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3054982"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS45731.2020.9180965"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662341"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731732"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3053503"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2011.2163634"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/EMBC.2019.8857243"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10575937\/10365390.pdf?arnumber=10365390","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,6,29]],"date-time":"2024-06-29T05:23:03Z","timestamp":1719638583000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10365390\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,7]]},"references-count":28,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3341865","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,7]]}}}