{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T15:51:10Z","timestamp":1772121070476,"version":"3.50.1"},"reference-count":50,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Industrial Technology Research Institute (ITRI) and"},{"name":"National Science and Technology Council (NSTC)-Taiwan"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,7]]},"DOI":"10.1109\/jssc.2023.3343669","type":"journal-article","created":{"date-parts":[[2023,12,29]],"date-time":"2023-12-29T19:53:21Z","timestamp":1703879601000},"page":"2297-2309","source":"Crossref","is-referenced-by-count":17,"title":["An 8b-Precision 6T SRAM Computing-in-Memory Macro Using Time-Domain Incremental Accumulation for AI Edge Chips"],"prefix":"10.1109","volume":"59","author":[{"given":"Ping-Chun","family":"Wu","sequence":"first","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Jian-Wei","family":"Su","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Yen-Lin","family":"Chung","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Li-Yang","family":"Hong","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Jin-Sheng","family":"Ren","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Fu-Chun","family":"Chang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Yuan","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Ho-Yu","family":"Chen","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Chen-Hsun","family":"Lin","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"given":"Hsu-Ming","family":"Hsiao","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7566-8185","authenticated-orcid":false,"given":"Sih-Han","family":"Li","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Shyh-Shyuan","family":"Sheu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Shih-Chieh","family":"Chang","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Wei-Chung","family":"Lo","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Chih-I","family":"Wu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan"}]},{"given":"Chung-Chuan","family":"Lo","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5311-4955","authenticated-orcid":false,"given":"Ren-Shuo","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4070-5059","authenticated-orcid":false,"given":"Chih-Cheng","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9689-1236","authenticated-orcid":false,"given":"Kea-Tiong","family":"Tang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6905-6350","authenticated-orcid":false,"given":"Meng-Fan","family":"Chang","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, National Tsing Hua University (NTHU), Hsinchu, Taiwan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2987714"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2992886"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/vlsit.2019.8776544"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662419"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310397"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2880918"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2515510"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/vlsic.2017.8008465"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2016.7573556"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2018.8510687"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502421"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2848999"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2963616"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2934831"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.23919\/vlsic.2019.8778028"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310398"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2907488"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2582864"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2019.8778160"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662435"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310401"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/cicc48029.2020.9075883"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2928043"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc47793.2019.9056933"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662392"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952773"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3005754"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062985"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062995"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062958"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062949"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3073254"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365984"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365958"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3108344"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc53895.2021.9634797"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731681"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731762"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365791"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067527"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067260"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067555"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/4.823449"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2008.4585992"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/MicroCom.2016.7522592"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/19.650787"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365932"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9366045"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10575937\/10376238.pdf?arnumber=10376238","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,9]],"date-time":"2025-01-09T19:48:36Z","timestamp":1736452116000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10376238\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,7]]},"references-count":50,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3343669","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,7]]}}}