{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T16:46:46Z","timestamp":1772642806523,"version":"3.50.1"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2023YFF1203600"],"award-info":[{"award-number":["2023YFF1203600"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61974130"],"award-info":[{"award-number":["61974130"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62074135"],"award-info":[{"award-number":["62074135"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/jssc.2023.3344587","type":"journal-article","created":{"date-parts":[[2024,1,23]],"date-time":"2024-01-23T20:48:47Z","timestamp":1706042927000},"page":"702-715","source":"Crossref","is-referenced-by-count":4,"title":["A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1060-7765","authenticated-orcid":false,"given":"Xiangdong","family":"Feng","sequence":"first","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9819-0660","authenticated-orcid":false,"given":"Yuxuan","family":"Luo","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-0633-970X","authenticated-orcid":false,"given":"Tianyi","family":"Cai","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"given":"Yangfan","family":"Xuan","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0778-105X","authenticated-orcid":false,"given":"Yunshan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Microaiot, Ltd., Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-5528-5299","authenticated-orcid":false,"given":"Yili","family":"Shen","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8041-282X","authenticated-orcid":false,"given":"Changgui","family":"Yang","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"given":"Qijing","family":"Xiao","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6238-4423","authenticated-orcid":false,"given":"Sijun","family":"Du","sequence":"additional","affiliation":[{"name":"Department of Microelectronics, Delft University of Technology, Delft, The Netherlands"}]},{"given":"Bo","family":"Zhao","sequence":"additional","affiliation":[{"name":"Institute of VLSI Design, Zhejiang University, Hangzhou, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310296"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2989585"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3134010"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3030995"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2022.3163284"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2019.8902918"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3114189"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067383"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2903471"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2927132"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3078633"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/cicc57935.2023.10121283"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2717937"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3222229"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2275661"},{"key":"ref16","first-page":"63","article-title":"Second-order delta-sigma modulation","volume-title":"Understanding Delta-Sigma Data Converters","author":"Pavan","year":"2017"},{"key":"ref17","first-page":"1","article-title":"The magic of delta-sigma modulation","volume-title":"Understanding Delta-Sigma Data Converters","author":"Pavan","year":"2017"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2009.2035267"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2949232"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914266"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2010973"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.870761"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2021.3068710"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2018.2881044"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067374"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10445390\/10412096.pdf?arnumber=10412096","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,3]],"date-time":"2024-03-03T08:52:14Z","timestamp":1709455934000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10412096\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":25,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2023.3344587","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}