{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,17]],"date-time":"2026-07-17T14:52:03Z","timestamp":1784299923139,"version":"3.55.0"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,7,1]],"date-time":"2024-07-01T00:00:00Z","timestamp":1719792000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174050"],"award-info":[{"award-number":["62174050"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62271194"],"award-info":[{"award-number":["62271194"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,7]]},"DOI":"10.1109\/jssc.2024.3352048","type":"journal-article","created":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T18:41:09Z","timestamp":1705948869000},"page":"2330-2344","source":"Crossref","is-referenced-by-count":7,"title":["A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protection"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1794-7279","authenticated-orcid":false,"given":"Meilin","family":"Wan","sequence":"first","affiliation":[{"name":"School of Microelectronics, Hubei University, Wuhan, Hubei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-9787-3863","authenticated-orcid":false,"given":"Zhen","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hubei University, Wuhan, Hubei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9943-2476","authenticated-orcid":false,"given":"Yin","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Hubei University of Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7170-2446","authenticated-orcid":false,"given":"Zhangqing","family":"He","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Hubei University of Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haoshuang","family":"Gu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Hubei University, Wuhan, Hubei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kui","family":"Dai","sequence":"additional","affiliation":[{"name":"Shenzhen Misec Technology Company Ltd., Shenzhen, Guangdong, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6404-5270","authenticated-orcid":false,"given":"Xuecheng","family":"Zou","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2569581"},{"key":"ref2","article-title":"Low-overhead integrity verification for electronics and beyond","author":"Zhang","year":"2018"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2636859"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2370531"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2019.2923503"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2017.2745799"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3035482"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2865584"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2015.7116294"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/CCST.2017.8167796"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/cryptography4020011"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2016.7479227"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3005715"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDSC.2018.2832201"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3050295"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/3342099"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372563"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1142\/S0129156418400219"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2852325"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2930532"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830158"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2440739"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3056218"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2022.3152665"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2013.2287182"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2506641"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3035207"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1587\/transele.2022ECP5050"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10575937\/10410891.pdf?arnumber=10410891","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,6,28]],"date-time":"2024-06-28T18:38:52Z","timestamp":1719599932000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10410891\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,7]]},"references-count":28,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3352048","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,7]]}}}