{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,21]],"date-time":"2026-04-21T15:10:05Z","timestamp":1776784205073,"version":"3.51.2"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62104207"],"award-info":[{"award-number":["62104207"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62261160647"],"award-info":[{"award-number":["62261160647"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Shenzhen Science and Technology Program","doi-asserted-by":"publisher","award":["JCYJ20220530143609020"],"award-info":[{"award-number":["JCYJ20220530143609020"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Shenzhen Science and Technology Program","doi-asserted-by":"publisher","award":["JCYJ20220818100609021"],"award-info":[{"award-number":["JCYJ20220818100609021"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Shenzhen Science and Technology Program","doi-asserted-by":"publisher","award":["KQTD20200909114730003"],"award-info":[{"award-number":["KQTD20200909114730003"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Guangdong Provincial Key Laboratory of Future Networks of Intelligence","award":["2022B1212010001"],"award-info":[{"award-number":["2022B1212010001"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2024,9]]},"DOI":"10.1109\/jssc.2024.3376251","type":"journal-article","created":{"date-parts":[[2024,3,27]],"date-time":"2024-03-27T19:13:30Z","timestamp":1711566810000},"page":"2960-2970","source":"Crossref","is-referenced-by-count":9,"title":["A 2.8 \u03bcs Response Time 95.1% Efficiency Hybrid Boost Converter With RHP Zero Elimination for Fast-Transient Applications"],"prefix":"10.1109","volume":"59","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-1582-8255","authenticated-orcid":false,"given":"Junyi","family":"Ruan","sequence":"first","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6529-0422","authenticated-orcid":false,"given":"Junmin","family":"Jiang","sequence":"additional","affiliation":[{"name":"Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-6889-8984","authenticated-orcid":false,"given":"Chenzhou","family":"Ding","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, China"}]},{"given":"Yunxiao","family":"Li","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, China"}]},{"given":"Yanhui","family":"Wu","sequence":"additional","affiliation":[{"name":"Shenzhen Pengshen Technology Company Ltd., Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9921-3211","authenticated-orcid":false,"given":"Ka","family":"Nang Leung","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6115-8886","authenticated-orcid":false,"given":"Xun","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Science and Engineering, and Guangdong Provincial Key Laboratory of Future Networks of Intelligence, The Chinese University of Hong Kong, Shenzhen, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3165820"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310369"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310370"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc53450.2021.9567838"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3098495"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2293629"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2011.2106231"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2157835"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3222613"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2188842"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365797"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3115631"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2959509"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067321"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310368"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2954109"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2307571"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/APEC39645.2020.9124150"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2019.8778075"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3210296"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063105"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2008.2009178"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/b100747"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2274826"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3044062"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3189161"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/4\/10648889\/10480401.pdf?arnumber=10480401","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,31]],"date-time":"2024-08-31T05:26:08Z","timestamp":1725081968000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10480401\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9]]},"references-count":26,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3376251","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,9]]}}}