{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T05:34:14Z","timestamp":1782970454969,"version":"3.54.5"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T00:00:00Z","timestamp":1738368000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFB2202600"],"award-info":[{"award-number":["2018YFB2202600"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U19B2041"],"award-info":[{"award-number":["U19B2041"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61774094"],"award-info":[{"award-number":["61774094"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Beijing Science and Technology (S&T) Project","award":["Z191100007519016"],"award-info":[{"award-number":["Z191100007519016"]}]},{"DOI":"10.13039\/501100001809","name":"Beijing Innovation Center for Future Chip","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,2]]},"DOI":"10.1109\/jssc.2024.3406569","type":"journal-article","created":{"date-parts":[[2024,6,13]],"date-time":"2024-06-13T13:53:06Z","timestamp":1718286786000},"page":"734-747","source":"Crossref","is-referenced-by-count":6,"title":["TensorCIM: Digital Computing-in-Memory Tensor Processor With Multichip-Module-Based Architecture for Beyond-NN Acceleration"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9657-3617","authenticated-orcid":false,"given":"Yiqi","family":"Wang","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zihan","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9639-6123","authenticated-orcid":false,"given":"Weiwei","family":"Wu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7548-4116","authenticated-orcid":false,"given":"Leibo","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6942-4395","authenticated-orcid":false,"given":"Yang","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5117-7920","authenticated-orcid":false,"given":"Shaojun","family":"Wei","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2228-8829","authenticated-orcid":false,"given":"Fengbin","family":"Tu","sequence":"additional","affiliation":[{"name":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2309-572X","authenticated-orcid":false,"given":"Shouyi","family":"Yin","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Beijing Innovation Center for Future Chip, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365791"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA53966.2022.00039"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731754"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3466752.3480113"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA52012.2021.00059"},{"key":"ref8","first-page":"1","article-title":"Semi-supervised classification with graph convolutional networks","volume-title":"Proc. Int. Conf. Learn. Represent.","author":"Kipf"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358284"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/nature14539"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310262"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/3445814.3446717"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067555"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.48550\/ARXIV.1906.00091"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731762"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067285"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3021661"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731645"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067842"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3222059"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA47549.2020.00012"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1088\/1674-4926\/45\/4\/040204"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2778281"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365958"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067779"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062958"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731657"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960488"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/10857664\/10555118.pdf?arnumber=10555118","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,2]],"date-time":"2025-12-02T18:48:18Z","timestamp":1764701298000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10555118\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2]]},"references-count":29,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3406569","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,2]]}}}