{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T05:21:16Z","timestamp":1782969676860,"version":"3.54.5"},"reference-count":44,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE J. Solid-State Circuits"],"published-print":{"date-parts":[[2025,5]]},"DOI":"10.1109\/jssc.2024.3463688","type":"journal-article","created":{"date-parts":[[2024,10,7]],"date-time":"2024-10-07T17:45:00Z","timestamp":1728323100000},"page":"1771-1781","source":"Crossref","is-referenced-by-count":4,"title":["A 3.96-\u03bcm, 124-dB Dynamic-Range, Digital-Pixel Sensor With Triple- and Single-Quantization Operations for Monochrome and Near-Infrared Dual-Channel Global Shutter Operation"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2732-7957","authenticated-orcid":false,"given":"Ken","family":"Miyauchi","sequence":"first","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Masayuki","family":"Uno","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Toshiyuki","family":"Isozaki","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hideyuki","family":"Fukuhara","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8521-0028","authenticated-orcid":false,"given":"Kazuya","family":"Mori","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hirofumi","family":"Abe","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Masato","family":"Nagamatsu","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0527-4601","authenticated-orcid":false,"given":"Rimon","family":"Ikeno","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3016-3348","authenticated-orcid":false,"given":"Isao","family":"Takayanagi","sequence":"additional","affiliation":[{"name":"Brillnics Japan Inc., Tokyo, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hsin-Li","family":"Chen","sequence":"additional","affiliation":[{"name":"Brillnics Inc, Hsinchu 302, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chih-Hao","family":"Lin","sequence":"additional","affiliation":[{"name":"Brillnics Inc, Hsinchu 302, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wen-Chien","family":"Fu","sequence":"additional","affiliation":[{"name":"Brillnics Inc, Hsinchu 302, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shou-Gwo","family":"Wuu","sequence":"additional","affiliation":[{"name":"Brillnics Inc, Hsinchu 302, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Song","family":"Chen","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lyle","family":"Bainbridge","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Menlo Park, CA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qing","family":"Chao","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ramakrishna","family":"Chilukuri","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Menlo Park, CA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wei","family":"Gao","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andrew P.","family":"Hammond","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tsung-Hsun","family":"Tsai","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chiao","family":"Liu","sequence":"additional","affiliation":[{"name":"Reality Labs, Meta Platforms Inc., Redmond, WA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019515"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.2352\/EI.2023.35.6.ISS-182"},{"key":"ref3","first-page":"1","article-title":"2.16\u03bcm back side illuminated voltage domain global shutter CMOS image sensor with single silicon layer pixel","volume-title":"IEDM Tech. Dig.","author":"Malinge","year":"2023"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2022.3164370"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.3390\/s20020486"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45741.2023.10413865"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3062576"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2022.3165520"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.3169\/mta.10.234"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365977"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731644"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067344"},{"key":"ref13","first-page":"250","article-title":"Sensors for future VR applications","volume-title":"Proc. Int. Image Sensor Workshop (IISW)","author":"Liu"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731584"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720526"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993566"},{"key":"ref17","first-page":"92","article-title":"A 640\u00d7480 image sensor with unified pixel architecture for 2D\/3D imaging in 0.11\u03bcm CMOS","volume-title":"Proc. Symp. VLSI Circuits\u2014Dig. Tech. Papers","author":"Kim"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177063"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2012.2214179"},{"key":"ref20","first-page":"267","article-title":"IR\/color composite image sensor with VIPS(vertically integrated photoiode structure)","volume-title":"Proc. IISW","author":"Lyu"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2007.914828"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177061"},{"key":"ref23","article-title":"1.4\u03bcm pixel, 8 MP, >5 \u03bcm epi, RGB-IR image sensor","volume-title":"Proc. IISW","author":"Skorka"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3138381"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2016.7573544"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2863947"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3142436"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2022.3164032"},{"key":"ref29","first-page":"1","article-title":"A fully digital time-mode CMOS image sensor with 22.9pJ\/frame\u00b7pixel and 92 dB dynamic range","volume-title":"IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Kim"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/lssc.2024.3370797"},{"key":"ref31","first-page":"16.1.1","article-title":"A 4.6 \u03bcm, 512\u00d7512, ultra-low power stacked digital pixel sensor with triple quantization and 127 dB dynamic range","volume-title":"IEDM Tech. Dig.","author":"Liu","year":"2020"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3121352"},{"key":"ref33","first-page":"21","article-title":"Evolution of a 4.6\u03bcm, 512\u00d7512, ultra-low power stacked digital pixel sensor for performance and power efficiency improvement","volume-title":"Proc. IISW","author":"Ikeno"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.3390\/s19245572"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.3390\/s23218847"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2009.09.015"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3097983"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3152977"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.3169\/mta.6.195"},{"key":"ref40","first-page":"238","article-title":"Evaluation of a small negative transfer gate bias on the performance of 4T CMOS image sensor pixels","volume-title":"Proc. IISW","author":"Han"},{"key":"ref41","first-page":"4","article-title":"Effects of negative bias operation and optical stress on dark current","volume-title":"Proc. IISW","author":"Watanabe"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2010.2049220"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2006.870753"},{"key":"ref44","first-page":"1","article-title":"A 3.96\u03bcm, 124 dB dynamic range, 6.2 mW stacked digital pixel sensor with monochrome and near-infrared dual-channel global shutter capture","volume-title":"Proc. IEEE Symp. VLSI Technol. Circuits (VLSI)","author":"Chen"}],"container-title":["IEEE Journal of Solid-State Circuits"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4\/10976259\/10706075.pdf?arnumber=10706075","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,25]],"date-time":"2025-04-25T05:26:20Z","timestamp":1745558780000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10706075\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5]]},"references-count":44,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/jssc.2024.3463688","relation":{},"ISSN":["0018-9200","1558-173X"],"issn-type":[{"value":"0018-9200","type":"print"},{"value":"1558-173X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,5]]}}}